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作 者:陈雷[1] 李荣志[1] 唐森[1] 见长江 朱鹤孙[1]
机构地区:[1]北京理工大学材料科学研究中心
出 处:《北京理工大学学报》1992年第4期48-54,共7页Transactions of Beijing Institute of Technology
基 金:高等学校博士学科点专项科研基金资助课题
摘 要:金属有机聚合物一般通过金属有机化合物单体聚合来制备,但由于单体制备困难、性能不稳定,其发展受到限制.本文提出了用低压直流电弧等离子喷射法将有机单体和金属直接合成金属有机聚合物薄膜的方法,成功地制备了铜与丙烯腈、丙炔腈的金属有机聚合物薄膜.红外光谱和电子能谱的分析结果表明:聚合物薄膜中含有环状共轭结构,铜与聚合物以共价键、配位键结合.用改进的四探针法进行测量,铜与丙炔腈聚合物薄膜的电阻率在10~0~10~3Ω·cm范围内,铜与丙烯腈聚合物薄膜的电阻率在10~6~10~7Ω·cm范围内。Organometallic polymers are habitually prepared from organometallic monomers. This is a hard work in view of difficulties in the synthesis of the monomers and their inherent instability. In this paper is presented a new method for preparing organometallic polymer films directly from the organic monomer and pure metal using low pressure DC arc plasma. Organometallic polymer films have been prepared simply from metallic copper and acrylonitrile or propynenitrile. Results of analysis with IR and ESCA showed that ring -shaped conjugated structures exist in the films. Copper atom may be linked to the polymer either by covalent bond or coordination bond. The electric resistivity of plasma poly (copper+propynenitrile) varies from 100 to 103Ω ·cm, that of plasma poly(copper+acrylonitrile) ranges from 106 to 107Ω·cm.
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