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作 者:冯佳伦[1] 张爱斌 周兰芬[1] 黄亦工[1] FENG Jia-lun;ZHANG Ai-bin;ZHOU Lan-fen;HUANG Yi-gong(Beijing Vacuum Electronics Research Institute,Beijing 100015,China)
机构地区:[1]北京真空电子技术研究所
出 处:《真空电子技术》2019年第4期45-50,共6页Vacuum Electronics
摘 要:本文介绍了热压铸95瓷工艺中Al 2O 3粉颗粒度和烧成温度对陶瓷抗折强度、密度和陶瓷-金属封接强度的影响。当D 50<4.0μm时,由于粉料团聚不易打开,容易造成陶瓷内部出现孔洞,致使抗折强度或密度出现大量不合格项,D 50=4.0~5.0μm时,陶瓷抗折强度或密度很少出现不合格项。烧结温度高于1640℃时,随着烧结温度的提高,陶瓷出现二次结晶,陶瓷晶粒越大,密度和抗折强度逐渐降低,封接强度有时升高有时降低,无规律。The effects of grain size of Al2O3 powder and sintering temperature on the flexural strength,density and ceramic-metal sealing strength of 95%ceramics made by hot pressure casting were introduced.When the alumina grain size D50 is less than 4.0μm,the powder agglomeration is not easy to open,which causes holes in ceramics and results in a large number of unqualified items of flexural strength or density.When the D50 is in 4.0-5.0μm range,the unqualified items of flexural strength or density of ceramics rarely occur.When the sintering temperature is higher than 1640℃,with the increase of sintering temperature,the secondary crystallization occurs,the grain size increases,the density and flexural strength decreases,while the sealing strength changes irregularly.
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