半导体芯片老化测试座的应用及市场综述  

Introduction to The Role and Global Market of Burn-in Sockets in Semiconductor Chip Testing

作　　者：张大为 Zhang Dawei(China Electronics Technology Group Corporation No.14 Research Institute,Nanjing Jiangsu,210039)

机构地区：[1]中国电子科技集团公司第十四研究所

出　　处：《电子测试》2019年第17期87-89,共3页Electronic Test

摘　　要：随着半导体技术的快速发展和芯片复杂度的逐年提高,芯片测试已贯穿于整个设计研发与生产过程,并越来越具有挑战性。老化测试是芯片在交付客户使用之前用以剔除早期失效产品的一项重要测试。为了避免反复焊接,不同封装类型的芯片在老化测试中由特制的老化测试座固定在老化板上。本文对老化测试座的应用进行了介绍,并对当前老化测试座的市场现状及中国测试设备公司的机遇和挑战进行了阐述。Semiconductor chip testing has become more challenging with rapid development of technology and increasing complexity of chips.Chip testing is now involved throughout the design and production processes.Burn-in test is used to screen out infant mortality failures beforeproductsare delivered to customers.In order to avoid repeated soldering,chips of different packaging types are mounted on burn-in boardsusing burn-in sockets.The industry application and the global market of burn-in sockets are introduced and explored in this paper.The opportunities and challenges for test equipment manufacturing companies in China are also discussed.

关 键 词：半导体芯片测试 老化测试座 质量控制 工业应用 市场综述 

分 类 号：TP3[自动化与计算机技术—计算机科学与技术]