DCPD酚醛环氧树脂分子量对其覆铜板PCT特性的影响  

Effect of molecular weight of DCPD phenolic epoxy resin on PCT characteristics of Copper Clad Laminates

作　　者：何烈相 潘华林[1] 肖富琼 李恒 He Liexiang;Pan Hualin;Xiao Fuqiong;Li Hen

机构地区：[1]国家电子电路基材工程技术研究中心广东生益科技股份有限公司

出　　处：《印制电路信息》2019年第9期38-40,共3页Printed Circuit Information

摘　　要：文章通过凝胶渗透色谱法(GPC)对双环戊二烯(DCPD)酚醛环氧树脂的分子量分布进行分析,并通过配方调整控制重均分子量小于400的低分子量分布占有比例,可有效解决部分DCPD酚醛环氧树脂与线性酚醛树脂固化制成的覆铜板的高压蒸煮测试(PCT)两小时失效问题。In this paper,the molecular weight distribution of DCPD phenolic epoxy resin was analyzed by GPC,and the occupancy ratio of the lower molecular weight distribution part less than 400 was adjusted through formulation in combination with biphenol type phenolic epoxy,which could effectively solve the PCT failure of the CCL made by curing the DCPD phenolic epoxy resin combination with the novolac resin.

关 键 词：环戊二烯酚醛环氧树脂 低分子量分布组份比例 高压蒸煮测试 

分 类 号：TN41[电子电信—微电子学与固体电子学]