挠性玻璃双面覆铜板的制备及性能测试  

Preparation and performance test of flexible glass double-sided Copper Clad Laminate

作　　者：梅昌荣 陈冠刚 何茂权 刘镇权 Mei Changrong;Chen Guangang;He Maoquan;Liu Zhenquan

机构地区：[1]广东成德电子科技股份有限公司,广东佛山528300

出　　处：《印制电路信息》2019年第9期41-47,共7页Printed Circuit Information

摘　　要：文章介绍用高铝硅酸盐玻璃基材来制作挠性玻璃双面覆箔板,然而进行了相关性能测试,结果表明挠性玻璃基板基本上符合挠性印制板要求,作为一种新型挠性基板,其前途是看好的。This paper introduces the fabrication of flexible glass double-sided foil-clad laminates with high alumina silicate glass substrates.However,relevant performance tests have been carried out.The results show that the flexible glass substrates basically meet the requirements of flexible printed boards.As a new type of flexible substrates,the future of flexible glass substrates is promising.

关 键 词：挠性玻璃基板 电浮法 弯曲强度 耐热冲击强度 

分 类 号：TN41[电子电信—微电子学与固体电子学]