填充型聚合物基导热复合材料的研究进展  

On Filled Polymer-based Thermal Conductive Composites

作　　者：张金成 冯一峻 肖文军[1] 吴连斌[1] ZHANG Jincheng;FENG Yijun;XIAO Wenjun;WU Lianbin(Key Laboratory of Organosilicon Chemical and Material Technology,Ministry of Education,Hangzhou Normal University,Hangzhou 311121,China)

机构地区：[1]杭州师范大学有机硅化学及材料技术教育部重点实验室

出　　处：《杭州师范大学学报（自然科学版）》2019年第5期476-482,共7页Journal of Hangzhou Normal University(Natural Science Edition)

基　　金：国家重点研究计划项目子课题(2017YFB0307702);浙江省基础公益研究计划项目(LGG18E030007);留学回国人员(团队)在杭创业创新项目;浙江省氟硅精细化学品及材料制造协同创新中心开放基金项目(FSi2018B004)

摘　　要：本征型导热聚合物存在合成困难等局限,填充性聚合物基导热复合材料具有巨大的发展潜力.本文综述了近年来国内外聚合物基导热复合材料的研究现状,简述了填充型聚合物基导热复合材料的导热机理,探讨了填料性能对复合材料导热性能的影响,介绍了不同填料聚合物基导热复合材料的研究进展,最后对其发展方向进行了展望.In view of the enormous marketing demands of thermally conductive materials,it's significant to develop new polymer-based thermal conductive composites.Filled polymer complex materials have more potential for development attributed to the defects of the intrinsic thermal conductive polymer such as the difficulty in synthesis.In this paper,the research status of polymer based thermal conductive composites at home and abroad in recent years are summarized.The thermal conducting mechanism of filled polymer-based composites is described,the effects of filler performance on the thermal conductivity of the composites are analyzed,and the recent advances in polymer-based thermal conductive composites with different filler are discussed.Finally,the development trends in the field are prospected.

关 键 词：聚合物基复合材料 导热机理 导热填料 表面改性 

分 类 号：TB[一般工业技术]