化学镀Ni-P-纳米SiO2复合镀层稳定剂的研究  

Research on the Stabilizers of Electroless Plating of Ni-P-nano SiO2 Composite Coatings

作　　者：安远飞 沈岳军 徐丽 聂梦 张黎 吴兴韦 刘定富[1] AN Yuanfei;SHEN Yuejun;XU Li;NIE Meng;ZHANG Li;WU Xingwei;LIU Dingfu(School of Chemistry and Chemical Engineering,Guizhou University,Guiyang 550025,China;China Aerospace Science and Technology Research Institute,Guizhou Space Appliance Stock Co.,Ltd.,Guiyang 550009,China)

机构地区：[1]贵州大学化学与化工学院,贵州贵阳550025 [2]中国航天科工集团第十研究院,贵州航天电器股份有限公司,贵州贵阳550009

出　　处：《电镀与环保》2019年第5期41-44,共4页Electroplating & Pollution Control

基　　金：贵大(国)创字2017(014);贵州省科技计划(黔科合GZ字[2015]3010)

摘　　要：以沉积速率、镀液的稳定性、复合镀层的孔隙率和显微硬度为评价指标,研究了碘酸钾和硫酸铜对化学镀NiP纳米SiO2复合镀层的影响。结果表明:单独使用碘酸钾作稳定剂时,碘酸钾适宜的质量浓度为60~80 mg/L;单独使用硫酸铜作稳定剂时,硫酸铜适宜的质量浓度为20~40 mg/L;当80 mg/L碘酸钾与20 mg/L硫酸铜复配时,沉积速率最快,孔隙率较低,显微硬度最高。The effects of potassium iodate and copper sulfate on electroless plating of Ni-P-nano SiO2 composite coating were studied by taking deposition rate,stability of the bath,porosity and microhardness of the composite coating as evaluation indexes.The results showed that the optimal mass concentration of potassium iodate was 60-80 mg/L when potassium iodate was used alone,while the optimal mass concentration of copper sulfate was 20-40 mg/L when copper sulfate was used alone.The deposition rale was the fastest,porosity was low and rnicrohardness was the highest when using compound stabilizers containing 80 mg/L potassium iodate and 20 mg/L copper sulfate.

关 键 词：化学镀Ni-P-纳米SiO2复合镀层 稳定剂 碘酸钾 硫酸铜 

分 类 号：TQ153[化学工程—电化学工业]