三维互联宽带数字收发微系统热设计  

Thermal Design of Three-Dimensional Interconnected Broadband Digital Transceiver Microsystem

作　　者：章玮玮 叶锐[1] ZHANG Weiwei;YE Rui(No.38 Research Institute of CETC,Hefei 230088,China)

机构地区：[1]中国电子科技集团公司第三十八研究所

出　　处：《机械与电子》2019年第10期20-24,共5页Machinery & Electronics

基　　金：安徽省重点研究与开发计划(201904a05020078)

摘　　要：为了提高三维互联微电子系统可靠性,展开微系统高效热管理研究并提出适应系统的热设计方案。针对三维构架下的宽带数字收发微系统,通过分析不同层间功率器件的传热路径和热阻组成,提出了节点优化的高效热管理方案,并采用热仿真软件分析了方案散热性能与系统热分布。发现系统最高温度出现在最不利传热路径上,器件最高壳温不超过80℃,满足微系统稳定运行的要求。该结果表明,对三维互联构架下关键传热材料与传热界面的优化设计可以有效降低路径上综合热阻,维持较低器件温度,满足设备工作需求。In order to improve reliability of 3D interconnected microelectronic system,efficient thermal management was studied and corresponding thermal design was proposed.Aiming at the broadband digital transceiver microsystem with 3D interconnect architecture,heat transfer path and thermal resistance of power devices on different layers were analyzed,and an optimized efficient thermal management scheme was proposed.Moreover,thermal performance and heat distribution in microsystem were analyzed by thermal simulation software.Through simulation analysis,it was found that the highest temperature in microsystem appeared on the most unfavorable heat transfer path,and the maximum shell temperature was below 80℃,which satisfies stable operation of the microsystem.The results show that the optimized design of key heat transfer material and interface can reduce the comprehensive thermal resistance significantly,and maintain the low component temperature to meet the demand of system.

关 键 词：三维互联 微系统 热管理 热设计 传热路径 

分 类 号：TK172[动力工程及工程热物理—热能工程]