UF-RO工艺回用处理半导体废水  

Treatment and reuse of semiconductor wastewater by UF-RO process

作　　者：王春冬 李正华 应晓芳 WANG Chun-dong;LI Zheng-hua;YING Xiao-fang(Semiconductor Manufacturing International(Shanghai)Corp.,Shanghai 201203,China)

机构地区：[1]中芯国际集成电路制造(上海)有限公司

出　　处：《工业用水与废水》2019年第5期75-77,共3页Industrial Water & Wastewater

摘　　要：半导体制造过程中产生的晶背研磨废水具有有机物浓度低,悬浮物含量高的特点,针对某半导体厂的晶背研磨废水和反洗废水,设计采用UF-RO工艺处理。工程应用表明:在晶背研磨废水TOC质量浓度为0.5~5.0 mg/L,浊度为80~100 NTU,SiO2质量浓度为2~4 mg/L,反洗废水TOC质量浓度为1.5~3.0 mg/L,浊度为4~8 NTU时,处理出水TOC质量浓度低于1 mg/L,浊度低于0.1 mg/L,SiO2质量浓度低于1 mg/L,完全可以回用至超纯水预处理系统。In view of the fact that backside grinding wastewater from semiconductor production has characteristics of low organic matters concentration and high suspended solid content,UF-RO process was designed to treat backside grinding and backwash wastewater from a semiconductor plant.The engineering application showed that,under the condition that the mass concentrations of TOC and SiO2 as well as the turbidity in the backside grinding wastewater were 0.5-5.0 mg/L,2-4 mg/L,and 80-100 NTU respectively,the revalant indexes in the effluent water were lower than 1,1 and 0.1 mg/L respectively,which indicated that the effluent water could be reused to ultrapure water pretretment system.

关 键 词：半导体废水 晶背研磨废水 超滤 反渗透 

分 类 号：X703.1[环境科学与工程—环境工程]