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作 者:邢红立 刘欣伟 刘丽 刘方方[1] 叶梦醒 赵天骄 XING Hong-li;LIU Xin-wei;LIU Li;LIU Fang-fang;YE Meng-xing;ZHAO Tian-jiao(College of Textile and Garment,Hebei University of Science and Technology,Shijiazhuang 050018,China)
机构地区:[1]河北科技大学纺织服装学院,河北石家庄050018 [2]河北科技大学化学与制药工程学院,河北石家庄050018
出 处:《电镀与涂饰》2019年第20期1113-1119,共7页Electroplating & Finishing
基 金:河北省教育厅2018重点项目(ZD2018235)
摘 要:以由聚醚胺D2000和甲基异丁基甲酮(MIBK)自制的固化剂与六亚甲基二异氰酸酯三聚体(3HDI)进行固化,并与D2000/3HDI体系和3HDI/空气体系进行室温凝胶时间和高温固化时间比较,同时采用非等温差示扫描量热法(DSC)对D2000-MIBK/3HDI体系进行不同升温速率下的固化研究。结果表明:D2000-MIBK/3HDI体系具有低温潜伏性和高温固化性,在室温时相对稳定,凝胶时间长,在高温时固化加快。结合FWO和Crane方程求得反应平均活化能Ea=84.35 kJ/mol,反应级数n=1.23,指前因子A=7.50×106 min?1,并得到了表观动力学方程。在实验条件下,当环境温度为352.42 K时,D2000-MIBK/3HDI体系固化开始有较快的起始反应速度,达到最大放热速率时的温度为410.52 K,温度为496.86 K时反应结束。The curing of hexamethylene diisocyanate trimer(3HDI)was conducted by using a homemade curing agent prepared from polyetheramine D2000 and methyl isobutyl ketone(MIBK)and compared with the D2000/3HDI system and 3HDI/air system with respect to room-temperature gelation time and high-temperature curing time.The curing of D2000-MIBK/3HDI system was studied by non-isothermal differential scanning calorimetry(DSC)at different heating rates.The results showed that the D2000-MIBK/3HDI system is relatively stable at room temperature with a long gelation time,but is cured fast at high temperature,having latent property at low temperature and curability at high temperature.Based on the FWO and Crane equations,the average activation energy(Ea),reaction order(n),and pre-exponential factor(A)were calculated as 84.35 kJ/mol,1.23,and 7.50×10^6 min^?1,respectively.The apparent kinetic equation was also obtained.The curing of D2000-MIBK/3HDI system under the experimental conditions has a fast reaction rate initially when the ambient temperature is 352.42 K.The maximum exothermic rate is at 410.52 K for this system,and the curing reaction is completed at 496.86 K.
分 类 号:TQ314.24[化学工程—高聚物工业]
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