5G通讯对移动通讯终端用电路板技术的新挑战  

New Challenge of 5G Communication to PCB Technology for Mobile Communication Terminal

作　　者：何立发 文伟峰 朱贵娥 查红平 郭达文 HE Li-fa;WEN Wei-feng;ZHU Gui-e;ZHA Hong-ping;GUO Da-wen(Redboard(JiangXi)Ltd,Ji’an,Jiangxi 343100)

机构地区：[1]红板(江西)有限公司

出　　处：《电子元器件与信息技术》2019年第8期43-45,共3页Electronic Component and Information Technology

摘　　要：5G商用的到来对移动通讯终端用电路板技术提出了新的挑战。文章论述了5G时代移动通讯终端用电路板的高密度、高频高速、高发热等主要特点,对电路板介质材料、铜箔的选择以及电路板的设计提出了建议,并分析了制造技术的新要求和改进方向。The arrival of 5G commercialization has presented new challenges to the PCB technology for mobile communication terminals.In this paper,the main characteristics of high density,high frequency,high speed and high heating of PCB for mobile communication terminals in 5G era are discussed.Suggestions are made on the selection of dielectric materials,copper foil and the design of PCB,and the new requirements and improvement direction of manufacturing technology are analyzed.

关 键 词：5G 移动通讯终端 高密度 高频高速 高发热 制造技术 

分 类 号：TN929.5[电子电信—通信与信息系统]