基于高光谱成像芯片中布拉格反射镜的设计和制备  

Design and fabrication of DBR based on hyperspectral imaging chip

作　　者：王天鹤 刘舒扬[1] 张晨 贾晓东[1] Wang Tianhe;Liu Shuyang;Zhang Chen;Jia Xiaodong(Tianjin Jinhang Institute of Technical Physics,Tianjin 300308,China)

机构地区：[1]天津津航技术物理研究所

出　　处：《红外与激光工程》2019年第10期218-224,共7页Infrared and Laser Engineering

基　　金：天津市自然科学基金青年项目(16JCQNJC02200)

摘　　要：针对传统高光谱成像系统体积质量大、光机结构复杂、成本高等缺点,亟待微小型化的需求,开展高光谱成像芯片中布拉格反射镜设计和制备的研究,根据布拉格分布膜系理论开发的多层膜系结构的模拟器,并根据结构设计完成了5层和7层膜系布拉格反射镜的制作,利用可见/近红外分光光度计,对布拉格反射镜的反射率进行测量,与模拟器进行对比,由于布拉格镜的实际制备存在"瑕疵",导致误差≤3%,多层膜系结构模拟器可以指导实际布拉格反射镜的制备,为高光谱成像芯片化奠定基础。Aiming at the shortcomings of traditional hyperspectral imaging system, such as large volume and weight, complicated structure of optical machine and high cost, it was urgent to meet the needs of miniaturization. The research on the design and preparation of distributed Bragg reflector(DBR) in hyperspectral imaging chip was carried out, and the simulator of multilayer film structure was developed.The fabrication of 5-layer film DBR and 7-layer film DBR were completed according to the structural design. The visible/near-infrared spectrophotometer was used to measure the reflectivity of the DBR, and the simulator for comparison, due to the existence of "flaw" in the actual preparation of the DBR,resulting in a error of 3%, The multilayer film structure simulator can guide the preparation of the actual DBR and lay the foundation for the hyperspectral imaging chip.

关 键 词：高光谱成像芯片 布拉格反射镜设计 法珀腔多光束干涉 多层膜系结构 

分 类 号：TN204[电子电信—物理电子学]