玻璃包覆铜电子浆料的制备及铜膜性能研究  

Preparation of Glass Coating Copper Electronic Paste and Properties of Copper Film

作　　者：张宝强 王硕 高春兰 杨德安[1] ZHANG Bao-qiang;WANG Shuo;GAO Chun-lan;YANG De-an(Key Laboratory for Advanced Ceramics and Machining Technology Ministry of Education,School of Materials Science and Engineering,Tianjin University,Tianjin 300350,China)

机构地区：[1]天津大学材料科学与工程学院教育部先进陶瓷与加工技术重点实验室

出　　处：《硅酸盐通报》2019年第10期3040-3046,共7页Bulletin of the Chinese Ceramic Society

摘　　要：为探究玻璃包覆量和共烧温度对铜膜性能的影响,通过溶胶凝胶法制备玻璃包覆铜粉,并与有机载体混合制备铜浆。将铜浆印刷在玻璃/陶瓷基板上低温共烧,制备铜膜/基板试样。采用X射线衍射(XRD)、扫描电子显微镜(SEM)表征了铜膜的晶相和形貌。采用四探针法和拉伸法测定了铜膜的方阻和附着力。研究了玻璃包覆量和共烧温度与铜膜晶相和显微结构的关系,以及对铜膜方阻和附着力的影响。结果表明,在低温共烧的过程中,没有检测到铜膜晶相的变化;当共烧温度为920℃时,10wt%玻璃包覆铜粉制备的烧结铜膜,表面平整,导电性能好,方阻为8 mΩ/,附着力为4. 26 MPa;15wt%玻璃包覆铜粉制备的烧结铜膜,与基板结合紧密,方阻为10. 5 mΩ/,附着力为8 MPa。In order to investigate the effects of glass coating amount and co-firing temperature on the properties of copper film,the glass-coated copper powders were prepared by sol-gel method and then mixed with organic carrier to prepare copper electronic pastes.The pastes were printed on the glass/ceramic substrate and co-fired at low temperature to prepare copper film/substrate samples.The samples were characterized by X-ray diffraction(XRD)and scanning electron microscopy(SEM).The sheet resistance and adhesion strength of the copper film were measured by four-probe method and tensile method respectively.The phase,microstructures,sheet resistance and adhesion strength of copper films,which were related to glass coating amount and co-firing temperature,were studied.The results show that no phase change of copper film is observed during the low temperature co-firing process.When sintered at 920℃,the copper film with 10wt%glass-coating possesses smooth surface and good electrical conductivity;the copper film with 15wt%glass-coating bonds tightly to the substrate.The sheet resistance of the two films are 8 mΩ/□and 10.5 mΩ/□,and the adhesion strength are 4.26 MPa and 8 MPa,respectively.

关 键 词：溶胶凝胶法 玻璃包覆铜粉 附着力 方阻 

分 类 号：TM241[一般工业技术—材料科学与工程]