外壳材料及制造过程对器件封装内部氢含量的影响研究  

Influence of Packaging Material&Manufacturing process on Internal Hydrogen Content of Device Packaging

作　　者：钟永辉 方军[1] 夏明旷 黄志刚[1] 杨磊[1] ZHONG Yong-hui;FANG Jun;XIA Ming-kuang;HUANG Zhi-gang;YANG Lei(No.43 Research Institute of CETC,Hefei 230088,China)

机构地区：[1]中国电子科技集团公司第四十三研究所,合肥230088

出　　处：《混合微电子技术》2018年第4期90-94,共5页Hybrid Microelectronics Technology

摘　　要：本文针对传统可伐金属封装,研究了封装材料及外壳制造过程对器件封装内部氢含量的影响。研究表明:可伐材料基体贮存一定含量的氢,且封装材料在外壳制造过程中存在吸氢行为。器件封装内部氢含量受封装原材料及外壳制造过程影响,通过真空烘烤可以将器件封装内部氢含量控制在较低水平。in this paper,the effect of packaging material and manufacturing process on the internal hydrogen content of device packaging is studied for traditional kovar packaging.The results show that hydrogen content of the kovar material can be stored,and the hydrogen absorption behavior of the packaging material in the package manufacturing process.The internal hydrogen content of device packaging is influenced by the packaging raw material and the manufacturing process.The hydrogen content of the device can be controlled to a low level by vacuum baking.

关 键 词：外壳材料 制造过程器件封装内部氢含量 

分 类 号：TN305.94[电子电信—物理电子学] TG148[一般工业技术—材料科学与工程]