LED封装用键合丝的性能分析对比  

Analysis and Comparison of Performance of Bonding Wire in LED Packaging

作　　者：黎学文 蔡济隆 陈磊 林金填 LI Xuewen;CAI Jilong;CHEN Lei;LIN Jintian(Xuyu Optoelectronics(Shenzhen)Co.,Ltd.,Shenzhen 518126,China;Southwest University of Science and Technology,Mianyang 621010,China;Opto-Mecharonics Laboratory,Research Institute of Tsinghua University in Shenzhen,Shenzhen 518057,China)

机构地区：[1]旭宇光电(深圳)股份有限公司,广东深圳518126 [2]西南科技大学,四川绵阳621010 [3]深圳清华大学研究院,光机电一体化重点实验室,广东深圳518057

出　　处：《中国照明电器》2019年第9期18-22,共5页China Light & Lighting

基　　金：深圳市科技计划(重20180027);深圳市科技计划(深科技创新[2019]33号)

摘　　要：键合丝是发光二极管封装中应用的关键材料之一,是发光二极管高效封装的基础。由于键合金丝成本高企,众多LED封装厂家选择应用低成本合金丝来替代键合金丝。本文介绍了键合丝的特点和性能要求,综述了键合金丝、金合金丝、银合金丝的组成、性能、使用、可靠性等研究进展,并以北京达博有色金属焊料有限责任公司提供的4款产品为例进行了应用测试,比较了其性能差异,为合金丝的应用提供支持。Bonding wire is one of the key materials applied in light emitting diode packaging.It is the foundation of high-efficient LED packaging.Due to the high cost of gold bonding wire,many LED packaging manufacturers chose low cost alloy bonding wire instead of gold bonding wire.This paper introduced the characteristics and the performance demands of bonding wire.The research progress on the composition,performance,application and reliability of gold bonding wire,gold alloy bonding wire and silver alloy bonding wire was summarized.Four products provided from Beijing Doublink Solders Co.,LTD were tested in LED packaging application as examples to compare their differences in performance,which can provide support for the application of alloy bonding wire.

关 键 词：LED 键合丝 合金丝 性能 可靠性 

分 类 号：TG146[一般工业技术—材料科学与工程]