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作 者:郭文义[1] 郭同诚 苏日嘎啦 孙光明 王宇[2] 黄金田[2] GUO Wenyi;GUO Tongcheng;SU Rigala;SUN Guangming;WANG Yu;HUANG Jintian(College of Mechanical and Electrical Engineering;College of Material Science and Art Desig,Inner Mongolia Agricultural University,Hohhot 010018,China)
机构地区:[1]内蒙古农业大学机电工程学院,呼和浩特010018 [2]内蒙古农业大学材料科学与艺术设计学院,呼和浩特010018
出 处:《内蒙古农业大学学报(自然科学版)》2019年第5期70-75,共6页Journal of Inner Mongolia Agricultural University(Natural Science Edition)
基 金:内蒙古自治区科技创新引导项目,KCBJ2018013
摘 要:为了提高木材-金属铜复合材料的电学性能,本试验以杨木旋切单板为基材,利用化学镀技术,在经过精细化预处理的杨木单板表面沉积金属铜单质。主要研究了化学镀液pH值、镀液各组分相对浓度和镀液温度对于铜单质沉积量和杨木单板表面导电性能的关系,确定了理想的的化学镀铜工艺,研究了复合材料的电磁屏蔽性能。In this test,copper sulfate was used as the metal salt,formaldehyde was used as the reducing agent,disodium edetate and sodium potassium tartrate were used as the complexing agent,and potassium ferrocyanide was used as the stabilizer to configure the electroless plating solution.Electroless copper plating on the surface of a veneer activated by a copper salt.The effects of pH value,reaction temperature and relative concentration of plating solution on the metal deposition amount and surface resistivity of the plated plate were discussed.The suitable process parameters were determined and the electromagnetic shielding performance was studied.
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