基于响应面-遗传算法的CSP焊点随机振动应力与回波损耗双目标优化设计  

Optimization design with objectives of random vibration stress and return loss for CSP solder joint using RS and GA

作　　者：路良坤 黄春跃[1] 梁颖[2] 李天明[3] LU Liangkun;HUANG Chunyue;LIANG Ying;LI Tianming(School of Electro-Mechanical Engineering,Guilin University of Electronic Technology,Guilin 541004,China;Department of Electronic Engineering,Chengdu Aeronautic Vocational and Technology College,Chengdu 610021,China;Department of Automobile and Power Engineering,Guilin University of Aerospace Technology,Guilin 541004,China)

机构地区：[1]桂林电子科技大学机电工程学院,桂林541004 [2]成都航空职业技术学院电子工程系,成都610021 [3]桂林航天工业学院汽车与动力工程系,桂林541004

出　　处：《振动与冲击》2019年第21期221-228,共8页Journal of Vibration and Shock

基　　金：国家自然科学基金(51465012);军委装备发展部“十三五”装备预研领域基金项目;四川省科技计划资助项目(2018JY0292);广西研究生教育创新计划项目(YCSW2018136)

摘　　要：建立了芯片尺寸封装(Chip Scale Package,CSP)焊点有限元分析模型和电磁仿真模型,选取焊点直径、焊点高度和焊盘直径作为设计变量,以CSP焊点随机振动应力和回波损耗为目标值,设计17组焊点形态参数水平组合并建模进行仿真计算,采用响应曲面法对17组组合应力值、回波损耗值与CSP焊点形态参数间关系进行拟合,结合遗传算法对拟合函数进行优化设计,得到CSP焊点随机振动应力值和回波损耗值同时降低参数水平组合,并通过回波损耗测试实验对优化结果进行了验证。结果表明:优化后CSP焊点最大等效应力下降11%的同时回波损耗降低了2.78%,回波损耗实测试验验证了优化结果的正确性。The finite element analysis model and the electromagnetic simulation one for chip size package(CSP) solder joint were established. Choosing solder joint diameter, its height and welding pad diameter as design variables, taking CSP solder joint’s random vibration stress and return loss as objectives, 17 sets of solder joint morphological parametric level combinations were designed and modeled to do simulation computation. The response surface(RS) method was used to fit relations among 17 combination sets’ stress values, return loss values and CSP solder joint morphological parameters. The genetic algorithm(GA) was used to do optimization design for fitted functions to obtain CSP solder joint’s optimal random vibration stress values and return loss ones, and reduce its parametric level combination. The optimization results were validated with return loss measurement tests. The results showed that after optimization, the maximum equivalent stress of CSP solder joint drops by 11% while its return loss reduces by 2.78%;the actual measurement tests of return loss verify the correctness of the optimization results.

关 键 词：芯片尺寸封装 随机振动 回波损耗 响应面 遗传算法 

分 类 号：TN256[电子电信—物理电子学]