银铜合金再结晶过程组织性能演变研究  

Study on the Evolution of Microstructure and Properties during Recrystallization of Ag-Cu alloy

作　　者：侯江涛 郝庆乐 张雷 钟素娟 朱坤 谢明[2] 曲文卿[3] HOU Jiangtao;HAO Qingle;ZHANG Lei;ZHONG Sujuan;ZHU Kun;XIE Ming;QU Wenqing(Zhengzhou Research Institute of Mechanical Engineering Co.LTD.,Zhengzhou 450001,China;Kunming Institute of Precious Metals,State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Sino-Platinum Metals Co.Ltd.,Kunming 650106,China;School of Mechanical Engineering&Automation,Beihang University,Beijing 100191,China)

机构地区：[1]郑州机械研究所有限公司新型钎焊材料与技术国家重点实验室,郑州450001 [2]昆明贵金属研究所,贵研铂业股份有限公司稀贵金属综合利用新技术国家重点实验室,昆明650106 [3]北京航空航天大学机械工程及自动化学院,北京100191

出　　处：《贵金属》2019年第S01期40-43,共4页Precious Metals

基　　金：河南省省科技计划项目(No.182102210138)

摘　　要：银铜合金广泛应用于电工行业,通过硬度检测、电阻率检测、扫描电镜观察,研究了Ag-10Cu在退火过程析出行为对合金组织性能的影响。结果表明,300~500℃退火阶段,合金中铜基体颗粒开始析出,材料硬度及电阻率随退火温度增加而减小;500~700℃退火阶段,合金再结晶过程基本结束,析出铜颗粒长大,并向晶界生长,材料电阻率随退火温度的增加而增加,硬度逐渐趋于平缓。AgCu alloy is widely used in electrical industry.The effect of precipitation behavior of Ag-10Cu during annealing on the structure and properties of Ag-10Cu alloy was studied by hardness testing,resistivity testing and scanning electron microscopy.The results show that during annealing at 300~500℃,the grain size of the alloy increases gradually,the defects decrease,the alloy copper particles precipitate,and the hardness and resistivity decrease with the increase of annealing temperature.During annealing at 500~700℃,the recrystallization process of the alloy basically ends,the precipitated copper particles grow up and grow to the grain boundary,and the resistivity of the alloy decreases with annealing temperature.With the increase of temperature,the hardness gradually tends to be flat.

关 键 词：银铜合金 晶粒尺寸 显微硬度 电阻率 

分 类 号：TG453.9[金属学及工艺—焊接]