纳米铜/环氧树脂导热复合材料的制备、结构与性能  

Preparation, structure and properties of nano-Cu/epoxy thermally conductive composites

作　　者：胡延鹏 袁双龙[1] 方斌[1] 朱绪敏 杨向民 HU YanPeng;YUAN ShuangLong;FANG Bin;ZHU XuMin;YANG XiangMin(School of Materials Science and Engineering,East China University of Science and Technology,Shanghai 200237,China)

机构地区：[1]华东理工大学材料科学与工程学院

出　　处：《北京化工大学学报（自然科学版）》2019年第6期28-35,共8页Journal of Beijing University of Chemical Technology(Natural Science Edition)

摘　　要：通过液相还原法制备得到铜纳米线(CuNWs)及铜纳米片(CuNPs),将其与环氧树脂(EP)共混制备得到复合材料,利用导热系数测试、电阻测试和扫描电镜等手段对复合后材料的导热性能、绝缘性能以及微观结构进行了表征,结果表明:填充了CuNWs或CuNPs的EP在显著提升导热性能的同时仍然具有良好的绝缘性;当CuNWs和CuNPs的填充体积分数为11%时,复合材料的导热系数可分别提高至1.09 W/(m·K)和1.26 W/(m·K),相对于树脂基体导热系数分别提升了474%和563%,同时电阻率分别为9.0×1010Ω·cm和6.2×1010Ω·cm,保持了较好的绝缘性,显示出这类材料在导热领域有着广阔的应用前景。Copper nanowires(CuNWs)and copper nanoplates(CuNPs),were synthesized by a liquid phase reduction method and used as fillers with epoxy resin to prepare composite materials.The thermal conductivity,insulation properties and morphology of the resulting composites were characterized.Epoxy composites filled with CuNWs or CuNPs showed significantly improved thermal conductivity,while the insulation properties were still good.At a volume fraction of 11%of CuNWs and CuNPs,the thermal conductivity of composites reached 1.09 W/(m·K)and 1.26 W/(m·K)respectively,corresponding to thermal conductivity increases of 474%and 563%,respectively,compared to the pristine resin matrix.Furthermore,the resistivity was still greater than 2×1010Ω·cm,showing that the composites retained good insulating properties.Thus these copper nanomaterials show considerable promise as components of thermally conductive composites.

关 键 词：热导率 铜纳米材料 树脂基复合材料 绝缘 

分 类 号：O614.121[理学—无机化学] TB333[理学—化学]