红外制导导弹头罩温度场测量装置的设计  

Design of Temperature Field Measurement Device for Infrared Imaging Guided Missile Warhead

作　　者：孙明晓 季俊云 史岩峰[1] 陈玉玲[1] 张巧寿[1] SUN Ming-xiao;JI Jun-yun;SHI Yan-feng;CHEN Yu-ling;ZHANG Qiao-shou(Beijing Institute of Structure and Environment Engineering,Beijing 100076,China)

机构地区：[1]北京强度环境研究所

出　　处：《强度与环境》2019年第5期54-58,共5页Structure & Environment Engineering

摘　　要：针对红外成像制导导弹弹头温度场的特点,设计了多测点、宽量程、高采样率、小安装体积、高可靠性的温度场测量装置。装置分为温度探头和变换器两部分,温度探头由9路K型热电偶丝压接于接插件而成,变换器的电路基于ADS1018芯片和MSP430单片机进行了设计。对装配后的装置进行了可靠性试验考核及性能指标测试,各指标均满足要求。装置已应用于某型号导弹的弹头温度场测量飞行试验,试验数据用于弹头结构的优化设计。A temperature field measurement device of multi-points, wide-range, high sample rate, small size and high reliability is designed, specific to the characteristics of the temperature field of infrared imaging guided missile warhead. The device consists of two parts: temperature probe, which is formed from 9 K-type thermocouples crimped by the connector, and converter whose circuits are based on integrated chip ADS1018 and MSP430 SCM. The device assembled is evaluated by reliability and performance tests, while the results satisfy the requirements. The device has been applied on the warhead temperature filed flight measurement of a missile, and the data is used on the optimization design of the warhead structure.

关 键 词：红外制导导弹 温度场 飞行测量 热电偶 

分 类 号：V414.19[航空宇航科学与技术—航空宇航推进理论与工程]