大规模集成电路用Al-Cu合金的制备与组织性能  

Preparation and Microstructure Properties of Al-Cu Alloy for Large Scale Integrated Circuits

作　　者：李宽[1] 罗峰 刘志新[2] LI Kuan;LUO Feng;LIU Zhi-xin(Jilin Railway Technology College,Jilin 132200,Jilin,China;Jilin University,Changchun 130012,Jilin,China)

机构地区：[1]吉林铁道职业技术学院,吉林吉林132200 [2]吉林大学,吉林长春130012

出　　处：《铸造》2019年第11期1255-1260,共6页Foundry

摘　　要：为了研究Fe含量对集成电路用Al-Cu合金室温拉伸性能和显微组织的影响,采用重力铸造和挤压铸造的方法分别制备了Al-6Cu-0.6Mn-xFe(x=0.1,0.5,0.7,1.0,1.5)合金。研究结果表明,重力铸造和挤压铸造Al-Cu合金的强度和韧性都随着Fe含量增加而减小,但挤压铸造含铁Al-Cu合金的强度和韧性降低幅度要小于重力铸造的,而且挤压铸造对改善合金的韧性有明显效果;经过T5热处理后,铸态合金中块状α-Fe(Al15(FeMn)3(CuSi)2)、Al6(FeMn)相和带分支的棒状Al3(FeMn)相大部分都转变为新相α-(CuFe)-Al7Cu2(FeMn);挤压压力为75 MPa时,合金中富铁相要比挤压压力为0时含量更少且更加细小;合金中微米级Al20Cu2Mn3和纳米级θ’(Al2Cu)相的数量随着Fe含量的增加而减少,一定程度上降低了合金的力学性能。Al-6Cu-0.6Mn-xFe(x=0.1,0.5,0.7,1.0,1.5) alloys were prepared by gravity casting and squeeze casting, respectively, in order to investigate the effects of Fe content on the microstructure and room temperature tensile properties of Al-Cu alloy for integrated circuits. The results of tensile properties testing at room temperature show that both gravity cast and squeeze cast Al-Cu alloys have a decrease in the strength and ductility with an increase in Fe content, but the decrease range for squeeze cast alloys is less than that of gravity cast alloys, and squeeze casting has an obvious effect for the improvement of ductility of Al-Cu alloys. After T5 heat treatment, a majority of bulk α-Fe, Al6(FeMn) and the rod-shaped Al3(FeMn) phase with branch in the as-cast Al-Cu alloys are transformed into new phase α-(CuFe)-Al7Cu2(FeMn). When an extrusion pressure of 75 MPa is applied, the iron-rich phase particles in the alloys become less and finer than that with no extrusion pressure. The number of micron Al20Cu2Mn3 phase and nanometer θ′(Al2Cu) phase decreases with an increase in Fe content, which declines the mechanical properties of the alloys to some extent.

关 键 词：Fe含量 AL-CU合金 富铁相 组织 力学性能 

分 类 号：TG146.2[一般工业技术—材料科学与工程]