两种PXI机箱散热方案的对比  

Comparison of Two Heat Dissipation Solutions of PXI Chassis

作　　者：朱刚 宋斌 刘尧峰 Zhu Gang;Song Bin;Liu Yaofeng(Chengdu Tianao measurement and Control Technology Co.,Ltd,Chengdu Sichuan,611731)

机构地区：[1]成都天奥测控技术有限公司

出　　处：《电子测试》2019年第24期112-113,共2页Electronic Test

摘　　要：随着PXI系统功能和集成化程度的提高,对PXI机箱的散热需求也大幅度提高。本文着眼PXI机箱内部结构特点和散热需求的分析,通过对两种典型的PXI机箱散热方案特点对比,进而讨论了两种散热方案的差异。以期为生产实践中的PXI系统机箱散热设计和应用提供参考性研究。With the improvement of the function and integration degree of PXI system,the demand for heat dissipation of PXI chassis is also greatly improved.Focusing on analyzing the internal structure characteristics and heat dissipation requirements of PXI chassis,the paper compares the characteristics of two typical solutions for heat dissipation of PXI chassis,and then discusses the differences between the two heat dissipation solutions.The paper is expected to provide reference research for the design and application of heat dissipation of PXI system chassis in production practice.

关 键 词：PXI 散热 风道 

分 类 号：TP3[自动化与计算机技术—计算机科学与技术]