富含酰胺键的新型环氧树脂的制备及其性能研究  

Study on the preparation and properties of novel epoxy resin enriched with amide bonds

作　　者：刘渊 龙明芬 刘双会 罗军 LIU Yuan;LONG Ming-fen;LIU Shuang-hui;LUO Jun(Engineering Research Center for Materials Protection of Wear and Corrosion of Guizhou Province,Guiyang University,Guiyang 550005,China)

机构地区：[1]贵州省材料磨损与腐蚀防护工程研究中心,贵州贵阳550005

出　　处：《热固性树脂》2019年第6期19-24,共6页Thermosetting Resin

基　　金：贵州省自然科学基金(黔科合基础[2018]1008);贵阳市科技局-贵阳学院科技创新及服务平台建设项目(GYU-KYZ[2019~2020]PT24-01)。

摘　　要：以间苯二甲酰胺为初始原料制备了酰胺环氧树脂,以核磁共振谱仪,傅里叶变换红外光谱仪和飞行时间质谱仪确认了其化学结构,并利用示差扫描量热仪对其固化行为作了研究。结果表明,与商品化双酚F型环氧树脂相比,即使未添加任何固化剂,酰胺环氧树脂也可在热作用下固化,且固化反应活化能较低,约80 kJ/mol。此外,采用4,4'-二氨基二苯基甲烷为固化剂时,对固化物的力学性能测试和热重分析研究结果表明,其固化物的拉伸强度达到102 MPa,800℃时的残炭率为47%,表现出优异的力学性能和良好的热稳定性。The amide epoxy resin was prepared with isophthalamide as the starting material.The chemical structure was confirmed by NMR spectroscopy,Fourier transform infrared spectroscopy and time-of-flight mass spectrometry.The curing behavior was investigated by differential scanning calorimeter.The results showed that compared with the commercial bisphenol F-type epoxy resin,the amide epoxy resin could be cured under the action of heat without adding any curing agent,and the activation energy of the curing reaction was low,about 80 kJ/mol.In addition,when the 4,4'-diaminodiphenylmethane was used as a curing agent,the mechanical property test and thermogravimetric analysis of the cured product showed that the tensile strength of the cured product reached 102 MPa,and the char yield at 800℃was 47%,showing excellent mechanical properties and good thermal stability.

关 键 词：间苯二甲酰胺 环氧树脂 固化反应活化能 拉伸强度 热稳定性 

分 类 号：TQ323.5[化学工程—合成树脂塑料工业]