真空热压扩散制备Ag-Ti双金属材料及其性能的研究  

Study on Preparation and Properties of Ag-Ti Bimetallic Materials by Vacuum Hot Pressure Diffusion

作　　者：邹军涛[1] 李祥 薛振宇 倪迎瑞 梁淑华[1] ZOU Juntao;LI Xiang;XUE Zhenyu;NI Yingrui;LIANG Shuhua(Key Laboratory of Electrical Materials and Infiltration Technology,Xi*an University of Technology,Xi'an 71004&China;Shaanxi Gold Group Xi'an Qinjin Co.,Ltd.,Xi'an 710060,China)

机构地区：[1]西安理工大学陕西省电工材料与熔渗技术重点实验室,陕西西安710048 [2]陕西黄金集团西安秦金有限责任公司,陕西西安710060

出　　处：《热加工工艺》2019年第22期86-88,93,共4页Hot Working Technology

基　　金：国家重点研发计划项目(2017YFE0301402);国家自然科学基金项目(51401162,U1502274);陕西省科技计划项目(2018ZDXM-GY-136,2019JM-595);陕西省教育厅服务地方专项计划项目(15JF025)

摘　　要：采用真空热压扩散的方法制备了Ag・Ti双金属材料,并对扩散工艺、界面组织及性能进行研究。采用扫描电子显微镜(SEM)和能谱仪(EDS)对Ag-Ti双金属界面形貌和元素分布进行了分析,用显微硬度计对界面扩散层进行显微硬度表征。结果表明:通过真空热压扩散连接能够获得界面冶金结合的Ag-Ti双金属材料。界面扩散层由ot・Ti固溶体和AgTi化合物组成,AgTi的扩散激活能为159.3 kJ/mol,界面扩散层的硬度高于两侧基体的硬度。Ag-Ti bimetallic materials were prepared by vacuum hot-pressure diffusion method, and the diffusion process,interface structure and its properties were studied. The morphology and element distribution of Ag-Ti bimetallic interface wereanalyzed by scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS). The results show that, theinterfacial metallurgical bonding of Ag-Ti bimetallic material can be obtained by vacuum hot-pressure diffusion bonding. Theinterfacial diffusion layer is composed of solid solution a・Ti and compound AgTi. The diffusion activation energy of AgTi is159.3 kJ/mol, and the hardness of interfacial diffusion layer is higher than the hardness of the base metals on both sides.

关 键 词：黄金精炼 Ag-Ti双金属 扩散连接 界面 

分 类 号：TB331[一般工业技术—材料科学与工程] TG111.6[金属学及工艺—物理冶金]