新型无氨无氯钯镍合金电镀液的应用研究  

Research on brand new ammonia-free and chlorine-free Pd-Ni alloy

作　　者：杨晓新 杨海永 Yang Xiaoxin;Yang Haiyong

机构地区：[1]汕头超声印制板公司

出　　处：《印制电路信息》2019年第12期27-31,共5页Printed Circuit Information

摘　　要：电镀钯镍合金是一种新型的印制电路板表面涂饰工艺,性能优异,可满足终端多样化需求。文章针对一款环境友好的无氨无氯钯镍合金电镀液进行系列研究,确认相关因子对钯镍合金中钯含量控制、镀层品质等的影响,最终获得良好的合金镀层,实现该工艺在印制电路板加工中的量产化应用。As one of final surface finishes used in printed circuit board(PCB),electroplating palladium and nickel(Pd&Ni)alloy is brand new and excellent which can meet the end users’diverse demands.We have done a lot of research on this brand new eco-friendly fast-plating Pd&Ni alloy electrolyte,which is ammonia-free and chlorinefree.This article mainly elaborates on all the potential factors’impact on the Pd content and plating quality,which are playingkey roles in the high performance plating.Right now,this brand new fast-plating Pd&Ni alloy electrolyte has been applied in PCB mass production as final surface finish.

关 键 词：印制电路板 钯镍合金 电镀 表面处理 钯含量 

分 类 号：TN41[电子电信—微电子学与固体电子学]