基于固体聚硅氧烷的前驱体浸渍裂解法(PIP)制备C/SiOC复合材料及其微结构与力学性能研究（英文）  

C/SiOC Composites by a Modified PIP Using Solid Polysiloxane: Fabrication, Microstructure and Mechanical Properties

作　　者：吴青青 王震[1,3] 丁奇 倪德伟[1,3] 阚艳梅[1,3] 董绍明[1,5] WU Qing-Qing;WANG Zhen;DING Qi;NI De-Wei;KAN Yan-Mei;DONG Shao-Ming(The State Key Lab of High Performance Ceramics and Superfine Microstructures,Shanghai Institute of Ceramics,Chinese Academy of Sciences,Shanghai 200050,China;University of Chinese Academy of Sciences,Beijing 100049,China;Structural Ceramics and Composites Engineering Research Center,Shanghai Institute of Ceramics,Chinese Academy of Sciences,Shanghai 200050,China;ShanghaiTech University,Shanghai 201210,China;Center of Materials Science and Optoelectronics Engineering,University of Chinese Academy of Sciences,Beijing 100049,China)

机构地区：[1]中国科学院上海硅酸盐研究所,高性能陶瓷和超微结构国家重点实验室,上海200050 [2]中国科学院大学,北京100049 [3]中国科学院上海硅酸盐研究所,结构陶瓷与复合材料工程研究中心,上海200050 [4]上海科技大学,上海201210 [5]中国科学院大学材料与光电研究中心,北京100049

出　　处：《无机材料学报》2019年第12期1349-1356,共8页Journal of Inorganic Materials

基　　金：National Key Research and Development Program of China(2018YFB0704103);Youth Innovation Promotion Association CAS(2015202)

摘　　要：以熔融的MK树脂(聚甲基倍半硅氧烷)为前驱体,采用改进的前驱体浸渍裂解法(PIP)制备了致密的C/SiOC复合材料。为了降低MK树脂的固化温度,选择有机磺酸作为交联剂,并采用红外光谱分析仪(FT-IR)和热重分析–差热分析仪(TG-DTA)研究了MK树脂的固化机理和陶瓷化行为。研究表明:MK树脂的陶瓷产率高达85wt%,其裂解得到的SiOC陶瓷自由碳含量低于3wt%,有利于提高陶瓷的高温稳定性。经过8次PIP制备的C/SiOC复合材料的密度可达1.82 g/cm^3。对得到的C/SiOC复合材料进行三点弯曲测试,其弯曲强度为(312±25)MPa,表现出明显的非脆性断裂行为。A modified polymer infiltration and pyrolysis method(PIP)was developed to enhance the densification of C/SiOC composites,using molten MK resin(polymethylsilsesquioxane)as precursor.Organic sulfonic acid was added as cross-linking agent to lower the curing temperature.The cross-linking mechanism and ceramization behavior of MK resin was studied.A high ceramic yield of about 85 wt%and low free carbon content below 3 wt%are achieved,with excellent high-temperature stability of the derived SiOC.The modified PIP approach presents a high densification efficiency.After only 8 PIP cycles,the final C/SiOC composites possess a density of about 1.81 g/cm^3.Compared with those composites fabricated by conventional PIP process,the C/SiOC composites prepared by modified PIP process show a much denser microstructure with much more improved densification efficiency.Bending strength of the as-fabricated C/SiOC composites is of(312±25)MPa,showing obvious non-brittle fracture behavior.

关 键 词：C/SiOC复合材料 高效PIP 微观结构 交联机理 

分 类 号：TQ174[化学工程—陶瓷工业]