FlexMEMS-enabled hetero-integration for monolithic FBAR-above-IC oscillators  

作　　者：Chuanhai Gao Menglun Zhang Yuan Jiang 

机构地区：[1]State Key Laboratory of Precision Measuring Technology and Instruments, Tianjin University

出　　处：《Nanotechnology and Precision Engineering》2019年第3期105-109,共5页纳米技术与精密工程（英文）

基　　金：supported by National High Technology Research and Development Program of China(863 Program)under Grant No.2015AA042603;the 111 Project under Grant No.B07014;Nanchang Institute for Microtechnology of Tianjin University

摘　　要：In this work,a monolithic oscillator chip is heterogeneously integrated by a film bulk acoustic resonator(FBAR)and a complementary metal-oxide-semiconductor(CMOS)chip using FlexMEMS technology.In the 3 D-stacked integrated chip,the thin-film FBAR sits directly over the CMOS chip,between which a 4μm-thick SU-8 layer provides a robust adhesion and acoustic reflection cavity.The proposed system-on-chip(SoC)integration features a simple fabrication process,small size,and excellent performance.The oscillator outputs 2.024 GHz oscillations of-13.79 dB m and exhibits phase noises of-63,-120,and-136 dB c/Hz at 1 kHz,100 kHz,and far-from-carrier offset,respectively.FlexMEMS technology guarantees compact and accurate assembly,process compatibility,and high performance,thereby demonstrating its great potential in SoC hetero-integration applications.In this work, a monolithic oscillator chip is heterogeneously integrated by a film bulk acoustic resonator(FBAR)and a complementary metal-oxide-semiconductor(CMOS) chip using FlexMEMS technology. In the 3 D-stacked integrated chip, the thin-film FBAR sits directly over the CMOS chip, between which a 4 μm-thick SU-8 layer provides a robust adhesion and acoustic reflection cavity. The proposed system-on-chip(SoC) integration features a simple fabrication process, small size, and excellent performance. The oscillator outputs 2.024 GHz oscillations of-13.79 dB m and exhibits phase noises of-63,-120, and-136 dB c/Hz at 1 kHz, 100 kHz, and far-from-carrier offset, respectively. FlexMEMS technology guarantees compact and accurate assembly, process compatibility, and high performance, thereby demonstrating its great potential in SoC hetero-integration applications.

关 键 词：FlexMEMS Hetero-integration Film bulk acoustic resonator SYSTEM-ON-CHIP OSCILLATOR 

分 类 号：TN7[电子电信—电路与系统]