多尺度纳米银烧结接头连接强度及塑性  

Bonding strength and plasticity of multiscale composite nanosilver paste for low temperature sintering

作　　者：李昭[1] 刘洋[1] 张浩[1] 孙凤莲[1] LI Zhao;LIU Yang;ZHANG Hao;SUN Fenglian(Harbin University of Science and Technology,Harbin 150040,China)

机构地区：[1]哈尔滨理工大学

出　　处：《焊接学报》2019年第10期106-110,I0005,I0006,共7页Transactions of The China Welding Institution

基　　金：国家自然科学基金资助项目(51604090);黑龙江省自然科学基金资助项目(E2017050);黑龙江省普通本科高等学校青年创新人才培养计划资助项目(UNPYSCT-2015042)

摘　　要：以低温烧结连接使用的纳米银膏为研究对象,通过计算获得银膏中纳米银颗粒与微米银颗粒的最佳配比并制备复合银膏.研究了银膏中不同溶剂对接头孔隙形成的影响,对比了纳米银膏与复合银膏硬度、弹性模量及塑性因子.结果表明,在250℃的烧结温度下松油醇和酒精的混合有机溶剂有利于烧结接头质量的提升,其烧结层孔隙率明显低于乙二醇制备的复合银膏烧结接头.与纳米银膏烧结接头相比,复合银膏烧结层压痕面积较大,硬度与弹性模量较低.当烧结时间为10~30 min时,复合银膏烧结层塑性因子高于纳米银膏烧结层.Nano silver paste for low temperature sintering bonding was studied.The optimal ratio of nano silver particles to micro silver particles in the silver paste was calculated and then was made into composite silver paste.The effect of different solvents on the porosity of the sintering joint was investigated.Meanwhile,the hardness,elastic modulus,and plasticity of the sintered joints by nano silver paste and micro silver paste were studied.The results indicated that the composite silver paste using the mixed organic solvent improved the quality of the sintered joints under 250°C.The porosity in the joints was significantly lower using the mixed organic solvent than that using glycol.Compared with nano silver sintered joints,the sintered joints using composite silver paste showed larger indentation area but lower hardness and elastic modulus.When the sintering time ranged from 10min to 30min,the plasticity of the composite silver joints was higher than that of the nano silver sintered joints.

关 键 词：低温烧结 复合银膏 硬度 弹性模量 塑性 

分 类 号：TG425.1[金属学及工艺—焊接]