固溶温度对Al-Cu-Mg-Ag合金显微组织与力学性能的影响  

Effect of Solid-Solution Temperature on Microstructure and Mechanical Properties of Al-Cu-Mg-Ag Alloys

作　　者：王鹏 刘冠华[2] 刘志义[2] WANG Peng;LIU Guan⁃hua;LIU Zhi⁃yi(Shandong Yankuang Light Alloy Co Ltd,Jining 273500,Shandong,China;School of Materials Science and Engineering,Central South University,Changsha 410083,Hunan,China)

机构地区：[1]山东兖矿轻合金有限公司,山东济宁273500 [2]中南大学材料科学与工程学院,湖南长沙410083

出　　处：《矿冶工程》2019年第6期115-119,共5页Mining and Metallurgical Engineering

基　　金：国家重点研究与发展计划项目(2016YFB0300900)

摘　　要：通过金相显微镜、透射电镜、扫描电镜和室温拉伸试验研究了固溶温度对Al-Cu-Mg-Ag合金显微组织与力学性能的影响。结果表明:随着固溶温度提高(500~520℃),Al-Cu-Mg-Ag合金在190℃/2 h时效过程中析出的Ω相数量密度逐渐增加,而且Ω相的大小更均匀,从而导致合金的强度和热稳定性逐渐提高。热暴露(200℃/1 000 h)后,Ω相数量密度显著下降,从而导致Al-Cu-Mg-Ag合金的强度大幅下降。在热暴露过程中,Ω相的直径方向增长速率远远大于厚度方向增长速率。The effect of solid-solution temperature on the microstructure and mechanical properties of Al-Cu-Mg-Ag alloys were studied by metallographic microscope, transmission electron microscope, scanning electron microscope and room temperature tensile test. The results show that as the solution temperature increasing from 500 ℃ to 520 ℃, the quantitative density of Ω phase precipitated during the aging of Al-Cu-Mg-Ag alloy at 190 ℃ for 2 h increases gradually, and the Ω phase becomes more uniform in size. As a result, the strength and thermal stability of the alloy are also improved gradually. After thermal exposure at 200 ℃ for 1 000 h, the quantitative density of Ω phase decreases significantly, leading to a significant decrease in the strength of the Al-Cu-Mg-Ag alloy. It is shown that during the thermal exposure, the growth rate in the diameter direction of Ω phase is much greater than that in the thickness direction.

关 键 词：热处理 固熔处理 时效处理 第二相 AL-CU-MG-AG合金 固溶温度 力学性能 热稳定性 

分 类 号：TB302[一般工业技术—材料科学与工程]