碳纤维表面沉积铜工艺及其参数影响机理  

Deposition of Cu on Carbon Fibers and Influence Mechanisms

作　　者：吕钊钊 沙建军[1] 林冠璋 张兆甫 祖宇飞 代吉祥[1] 鲜玉强 张伟[2] 崔鼎[2] 严从林 Lv Zhaozhao;Sha Jianjun;Lin Guanzhang;Zhang Zhaofu;Zu Yufei;Dai Jixiang;Xian Yuqiang;Zhang Wei;Cui Ding;Yan Conglin(State Key Laboratory of Structural Analyses for Industrial Equipment,Dalian University of Technology,Dalian 116024,China;China Academy of Engineering Physics,Mianyang 621900,China)

机构地区：[1]大连理工大学工业装备结构分析国家重点实验室,辽宁大连116024 [2]中国工程物理研究院,四川绵阳621900

出　　处：《稀有金属材料与工程》2019年第12期4010-4015,共6页Rare Metal Materials and Engineering

基　　金：国家自然科学基金联合基金项目（U1630129）

摘　　要：为了改善碳纤维与铝基体的界面润湿性能和抑制基体与纤维的界面反应,需要在碳纤维表面沉积铜界面层。通过对传统电镀装置的改进,采用了超声振荡分散的电镀装置在碳纤维表面沉积了铜界面层,通过对电镀前碳纤维的预处理、电镀液成分的优选调配,解决了碳纤维铜界面层沉积过程中因纤维束丝难以分散而出现的"夹心"问题(束丝内部纤维难以沉积或不能均匀沉积);在此基础上,详细研究了电镀液添加剂、电镀液pH值、电镀时间等工艺参数对铜界面层的微观结构、铜界面层质量的影响机制,为制备碳纤维增强铝基复合材料提供了一定的技术支持。结果表明:使用适当的添加剂(CuCl2,C6H12O6S4Na2,OP-10)能够有效细化铜晶粒,可获得光滑连续且与碳纤维结合力强的铜界面层;pH值过高时,沉积的铜界面层不连续,适宜的pH值为0.8;同时也发现适宜条件下铜界面层厚度与电镀时间近似于正比关系。In order to improve the wetting behavior and refrain the chemical reaction, to prepare an interphase between carbon fiber and aluminum matrix is essential. In the present paper, conventional electroplating equipment was improved to deposit copper interphase on the carbon fibers. It was found that the improved equipment could effectively prepare a homogeneous interphase on carbon fibers with the help of fiber pretreatment. On this basis, the influence of plating additives, pH value of electroplating solution and plating time on the quality of copper interphase was investigated. The scanning electron microscopy and X-ray diffractometer were applied to characterize the microstructure and the consisting phase of interphase. The results indicate that a fine copper interphase with good interfacial bonding strength can be uniformly deposited on the carbon fibers with the help of plating additives. For obtaining a continuous copper interphase, the pH value of 0.8 is appropriate. Besides, the interphase thickness almost linearly increases with the increase of plating time under the appropriate condition.

关 键 词：碳纤维 电镀 铜界面层 金属基复合材料 

分 类 号：TG174.441[金属学及工艺—金属表面处理]