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作 者:程瑶 CHENG Yao(School of Information Engineering,Shanxi Institute of International Trade and Commerce,Xi'an 712000)
机构地区:[1]陕西国际商贸学院信息工程学院
出 处:《微型电脑应用》2019年第12期40-42,共3页Microcomputer Applications
基 金:陕西省科技厅项目(2018GY-199)
摘 要:化学镀镍是许多行业中广泛使用的镀层方法,然而,涂层的可用性受到与化学镀镍工艺相关的控制问题的限制。为了确保沉积质量,在电镀过程中应精确控制化学镀镍沉积物的超越性能,由于自发的、不稳定的反应和缺乏在线测量方法而使得这个问题具有挑战性。为了改善基于操作员的控制,提出了一种特殊的化学镀镍监测系统,系统特别针对用于电镀通孔(Plated-Through-Hole,PTH)板制造的化学镀镍工艺进行校准。该系统能够从镀镍工业的标准测量结果估计电镀工艺的电学、化学和沉积参数,同时还能够通过监督整个过程动态,即电化学过程来代替单独的参数监督。Electroless nickel plating is a coating method widely used in many industries.However,the availability of coatings is limited by the control issues associated with the electroless nickel plating process.In order to ensure the quality of the deposit,the overshoot performance of the electroless nickel deposit should be precisely controlled during the electroplating process due to the spontaneous,unstable reaction and lack of on-line measurement.In order to improve the operator-based control,this paper proposes a special electroless nickel plating monitoring system.The monitoring system is specially calibrated for the electroless nickel plating process for the manufacture of plated through-throw(PTH)plates.The system proposed is able to estimate the electrical,chemical and deposition parameters of the electroplating process from the standard measurements of the nickel plating industry,and can also supervise the entire process dynamics,i.e.,electrochemical processes,instead of individual parameter monitoring.
分 类 号:TP393[自动化与计算机技术—计算机应用技术]
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