固相烧结制备半导体用Mn–Si粉末多孔合金的性能表征  

Property characterization of Mn–Si powder porous alloy for semiconductors prepared by solid phase sintering

作　　者：任伟[1] REN Wei(Department of Equipment Engineering,Henan Technical College of Construction,Zhengzhou 450064,China)

机构地区：[1]河南建筑职业技术学院设备工程系

出　　处：《粉末冶金技术》2019年第6期456-460,共5页Powder Metallurgy Technology

摘　　要：以高纯Si粉和Mn粉为原料,利用固相烧结技术制备得到Mn-Si粉末多孔合金,对其组织结构及性能进行表征,分析烧结过程中孔隙形成机理。结果表明:600℃烧结温度可得到MnSi粉末,烧结温度升高到1000℃后,原有的Si与MnSi衍射峰已全部消失,烧结体中只剩下Mn5Si3物相成分;烧结体膨胀率和孔隙率都随烧结温度的增加表现出先增加后减小的变化规律,在烧结温度800℃时取得最大值,分别为8.86%和54.26%;在Mn颗粒和MnSi相之间存在明显空隙,随着Si与Mn元素之间扩散的继续,空隙持续增大进而连通形成层状,随着烧结温度增加到1000℃,Mn、Si、MnSi被消耗殆尽,合金中形成Mn5Si3结构。The Mn–Si powder porous alloys were prepared by solid phase sintering,using high purity Si powders and Mn powders as the raw materials.The microstructure and properties of Mn–Si powder porous alloys were characterized and the formation mechanism of pores in sintering process was analyzed.The results show that,the MnSi powders can be obtained at 600℃,with the increase of sintering temperature to 1000℃,the original diffraction peaks of Si and MnSi disappear,only Mn5Si3 phase is present in the sintered body.The expansion ratio and porosity of the sintered body first increase and then decrease with the increase of sintering temperature,and show the maximum values(8.86%and 54.26%)at 800℃.There is an obvious gap between Mn particles and MnSi phase,as the diffusion between Si and Mn continues,the gaps increase and then connect to form the lamellar structure;as the sintering temperature rises to 1000℃,Mn,Si,and MnSi is used up,the Mn5Si3 structure is formed.

关 键 词：固相烧结 多孔合金 显微结构 性能表征 

分 类 号：TG145[一般工业技术—材料科学与工程]