检索规则说明:AND代表“并且”;OR代表“或者”;NOT代表“不包含”;(注意必须大写,运算符两边需空一格)
检 索 范 例 :范例一: (K=图书馆学 OR K=情报学) AND A=范并思 范例二:J=计算机应用与软件 AND (U=C++ OR U=Basic) NOT M=Visual
作 者:武耀罡[1] 李顶河[1] 肖争光 邹佳林 WU Yao-gang;LI Ding-he;XIAO Zheng-guang;ZOU Jia-lin(College of Aeronautics and Engineering,Civil Aviation Universily of China,Tianjin 300300,China)
机构地区:[1]中国民航大学航空工程学院
出 处:《计算机仿真》2019年第12期190-195,共6页Computer Simulation
摘 要:随着压电陶瓷设计制造工艺的不断提升,基于压电陶瓷的微小损伤监测技术也不断提高。建立了基于压电陶瓷的铝合金孔损伤识别的仿真分析模型。通过理论计算解决了ABAQUS在动力学条件下无法求解压电陶瓷传感器电势的问题,即用应变变化趋势替代电势变化趋势。同时对铝合金孔损伤前后依次进行有限元仿真及分析,得到了不同孔损伤半径和深度下压电陶瓷传感器应变的变化情况,最后通过引入损伤识别指标--均方根偏差,直观的判别损伤的严重程度。研究表明,随孔损伤半径增加及深度增加,1号压电陶瓷传感器应变均增加,2号压电陶瓷传感器应变均降低,两者均方根偏差指标均呈上升趋势,即损伤前后压电陶瓷应变变化趋势明显增加,利用上述指标可以对损伤的累积过程进行实时监测。With the continuous improvement of the design and manufacturing technology of piezoelectric ceramics, the detection technology of micro damage based on piezoelectric ceramics is also improving. A simulation analysis model of hole damage identification for aluminum alloy based on piezoelectric ceramic was established to ensure the identification of the hole damage. It can solve the problem that the ABAQUS cannot unzip the electric potential of the piezoelectric ceramic sensor under the dynamic condition, that is, replacing the change trend in electric potential with the change trend in strain. At the same time, the changes in the strain of the piezoelectric ceramic sensor under the different radius and depth of the hole damages were obtained by the finite element simulation before and after the damage. Finally, the severity of damage has been discriminated by introducing the damage identification indicator, the root mean square deviation. The results show that with the increase of the radius and depth of the damage, the strain of the NO.1 piezoelectric ceramic sensor all increases and the strain of the NO.2 piezoelectric ceramic sensor all decreases, and both root mean square deviations are all rising, that is, the trend of strain of piezoelectric ceramics obviously increases before and after the damage. The cumulative damage process can be monitored in real time by using this indicator.
分 类 号:TN384[电子电信—物理电子学]
正在载入数据...
正在载入数据...
正在载入数据...
正在载入数据...
正在载入数据...
正在载入数据...
正在载入数据...
正在链接到云南高校图书馆文献保障联盟下载...
云南高校图书馆联盟文献共享服务平台 版权所有©
您的IP:216.73.216.249