21世纪电镀添加剂的进展 笫一部分──除油添加剂  

Progress in electroplating additives in 21st century: Ⅰ. Progress in degreasing additives

作　　者：方景礼[1] FANG Jingli(Chemistry Department,Nanjing University,Nanjing 210023,China)

机构地区：[1]南京大学化学系

出　　处：《电镀与涂饰》2020年第2期116-122,共7页Electroplating & Finishing

摘　　要：简述了国内外表面活性剂的有关法规与生物降解机理,介绍了低泡、低温、易生物降解、无磷除油剂用表面活性剂的种类、特性和配比。The regulations and biodegradation mechanisms related to surfactants at home and abroad.The types,properties,and compositions of surfactants for preparation of low-foam,low-temperature,easily biodegradable,and phosphorus-free degreasing agents were introduced.

关 键 词：除油剂 添加剂 表面活性剂 生物降解 机理 综述 

分 类 号：TG178[金属学及工艺—金属表面处理]