Al2O3陶瓷活性连接用AgCuInTi合金钎料性能  被引量:5

Properties of AgCuInTi alloy brazing filler metal for active joining of Al2O3 ceramic

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作  者:黄晓猛 齐岳峰 张国清 陈晓宇 郭菲菲 Huang Xiaomeng;Qi Yuefeng;Zhang Guoqing;Chen Xiaoyu;Guo Feifei(Beijing Engineering Technology Research Center of New Brazing Materials for Electronic Information,Beijing 100012,China;Beijing Non-ferrous Metal and Rare Earth Research Institute,Beijing 100012,China)

机构地区:[1]北京市电子信息用新型钎焊材料工程技术研究中心,北京100012 [2]北京有色金属与稀土应用研究所,北京100012

出  处:《焊接》2019年第12期46-49,I0028,共5页Welding & Joining

基  金:国家重点研发计划资助(2017YF0305700)。

摘  要:通过在Ag-26Cu-5Ti钎料中添加21.5%In,设计开发了一种新型AgCuInTi合金钎料,用于实现Al 2 O 3陶瓷与无氧铜的活性连接,同时改善流动性,提高活性。对钎料的固液相温度与润湿铺展性能进行分析,并测试了Al 2O 3/AgCuInTi/Cu试验件抗拉强度和气密性。通过金相显微镜、扫描电子显微镜观察试验件微观界面组织,进一步探究AgCuInTi合金钎料的活性连接反应机理。结果表明,AgCuInTi合金钎料在750℃实现了对陶瓷和金属的真空活性连,降低了钎焊温度,满足分级钎焊和补焊的需求,且形成结合紧密的反应界面,证明其对陶瓷具有良好的润湿性;钎焊过程中合金钎料中的Ti元素向Al 2 O 3陶瓷界面富集,形成多个界面产物,而合金钎料中Ag元素、Cu元素、In元素与无氧铜发生溶解扩散,生成新的化合物相,最终实现陶瓷与金属的冶金结合。A novel AgCuInTi alloy brazing filler metal was designed and developed by adding 21.5%In in Ag-26Cu-5Ti brazing filler metal to realize active joining between Al2O3 ceramic and oxygen-free copper.Solid-liquid temperature and wetting and spreading properties of the brazing filler metal were analyzed,and tensile strength and airtightness of Al2O3/AgCuInTi/Cu test pieces were tested.The micro-interface microstructure of test pieces was observed by metallographic microscope and scanning electron microscope to further explore active joining reaction mechanism of AgCuInTi alloy brazing filler metal.The results showed that AgCuInTi alloy brazing filler metal could realize vacuum active joining of ceramics and metals at 750℃ and form a tightly bonded reaction interface.During the brazing process,Ti element in the brazing filler metal was enriched at the interface of Al2O3 ceramics to form multiple interface products,while Ag element,Cu element,In element in brazing filler metal dissolved and diffused with oxygen-free copper to form a new compound phase.Finally,metallurgical bonding of ceramic and metal was achieved.

关 键 词:银基钎料 活性钎焊 钎焊性能 微观结构 

分 类 号:TG425.2[金属学及工艺—焊接]

 

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