千万像素光学芯片模组测试高精密定位基座的研究  

Research on Testing High Precision Positioning Base Withmillion Pixels Optical Chip Module

作　　者：芮晓光[1,2] 刘鑫培[2] 王传洋[2] 朱晓刚[3] RUI Xiaoguang;LIU Xinpei;WANG Chuanyang;ZHU Xiaogang(Suzhou Vocational University,Suzhou Jiangsu 215104,China;Soochow University,Suzhou Jiangsu 215104,China;Suzhou Chuangrui Electromechanical Technology Co.,Ltd.,Suzhou Jiangsu 215104,China)

机构地区：[1]苏州市职业大学,苏州215104 [2]苏州大学,苏州215104 [3]苏州创瑞机电科技有限公司,苏州215104

出　　处：《机械设计与研究》2019年第6期149-152,共4页Machine Design And Research

基　　金：国家肖然科学基金资助项目(51475315);苏州市科技计划资助项目(SYG201649)。

摘　　要：通过对芯片探针测试机理的研究,基于微/纳米力学相关理论,建立了探针测试数学模型;在理论研究的基础上,设计了4000万像素光学芯片模组测试高精密定位基座。经测试光学芯片模组的光学中心和镜头中心偏差±0.14mm/lm.对于BGA封装锡球点阵间距≤O.2 mm的产品,其探针电阻≤50mΩ,总弹力增大到1.25mm/g.By studying on the mechanism of chip probe testing,the mathematical model is established which bases on correlation theory of micro nano mechanics.On the basis of theoretical research,a high precision positioning base for 40 million pixels optical chip module testing is designed.The testing error rate of moduleoptical lens central has been increased from 5%to 1%from the test.For BGA packaged products with tin sphere lattice spacing greater than 0.2 mm,the probe resistance is less than 50 mQ,and the total elastic force is reduced to more than 1.25 mm/g.

关 键 词：千万像素级光学芯片 高精密定位基座 建模和测试 

分 类 号：TH122[机械工程—机械设计及理论] TH89