硅醇基POSS改性有机硅树脂的热性能  

Thermal Properties of Silicone Resin Modified by Silanol based POSS

作　　者：孔国强 于秋兵 李莹 魏化震 王康 尹磊 安振河 李居影 孙晓冬 毕卫东 Kong Guoqiang;Yu Qiubing;Li Ying;Wei Huazhen;Wang Kang;Yin Lei;An Zhenhe;Li Juying;Sun Xiaodong;Bi Weidong(Shandong Nonmetallic Material Institute,Jinan250031,China)

机构地区：[1]山东非金属材料研究所

出　　处：《工程塑料应用》2020年第2期98-101,共4页Engineering Plastics Application

摘　　要：以甲基苯基有机硅树脂作为基体,硅醇基笼形倍半硅氧烷(POSS)作为改性剂,研究了不同POSS加入量和不同POSS加入方式对有机硅树脂热性能的影响,并对不同结构硅醇基POSS改性的有机硅树脂的热性能进行了综合评价。结果表明,采用三硅醇苯基POSS作为改性剂且其质量分数为5%时,通过加热反应方式制备的改性甲基苯基有机硅树脂起始热分解温度和900℃热失重率分别为448.3℃和15.45%。与未改性的甲基苯基有机硅树脂相比,起始热分解温度提高了48.9℃,900℃热失重率降低了6.37%。With methylphenyl silicone resin as matrix and silanol based POSS as modifier,the influence of the amount of POSS and the way of adding POSS on the thermal properties of silicone resin was studied,and the comprehensive evaluation of the thermal properties of silicone resin modified by different structure of POSS was carried out.The results show that trisilicol phenyl POSS is used as modifier and its mass fraction is 5%,the initial thermal decomposition temperature and 900℃weight loss rate of the modified methylphenyl silicone resin are 448.3℃and 15.45%,respectively.Compared with the unmodified methylphenyl silicone resin,the initial thermal decomposition temperature increases by 48.9℃,and the thermal weight loss rate decreases by 6.37%at 900℃.

关 键 词：甲基苯基有机硅树脂 硅醇基笼形倍半硅氧烷 热性能 

分 类 号：TQ322.41[化学工程—合成树脂塑料工业]