基于MEMS器件的玻璃通孔内金属批量化填充制备  

Metal Mass Filling in Glass Through Via Based on MEMS Device

作　　者：李飞 石云波[1] 赵思晗 王彦林 刘俊[1] LI Fei;SHI Yun-bo;ZHAO Si-han;WANG Yan-lin;LIU Jun(North University of China,National Key Laboratory of Electronic Measurement Technology,Taiyuan 030051,China)

机构地区：[1]中北大学电子测试技术重点实验室

出　　处：《仪表技术与传感器》2020年第1期9-12,共4页Instrument Technique and Sensor

基　　金：国家自然科学基金国家重大科研仪器研制项目(51727808);国家自然科学基金项目(51705477);电子测试技术重点实验室稳定支持经费项目(WD614200104011804)

摘　　要：基于TGV(玻璃通孔)工艺实现圆片级真空封装的导线互联过程中,进行批量化的玻璃通孔金属填充是产品制备的必然选择。调研了玻璃加工的刻蚀技术,确定使用喷砂工艺制备通孔,基于孔径和形貌设计了两种电镀方案均实现了金属对孔的密封,通过比较2次电镀的时间和形貌,最终确定了双面溅射种子层进行电镀的方案,实现了批量化的TGV工艺制备。In the process of connecting wires of wafer level vacuum packaging which based on through glass via process,batching of through glass via metal filling is inevitable choice of preparation of product.The techniques of glass processing were investigated and the through via were prepared using sand blasting process.There were two electroplating schemes which were both designed based on aperture and morphology and achieved the holes sealing using metal.By comparing the time and morphology of two electroplating,plating scheme of double sputtering seed layer was determined and preparation process of through glass via batch production was achieved.

关 键 词：玻璃通孔工艺 晶圆级真空封装 金属填充 喷砂工艺 电镀 批量化 

分 类 号：TP212[自动化与计算机技术—检测技术与自动化装置]