钎焊中Au80Sn20共晶钎料与Ni/Au镀层的界面反应  

Interface reaction between Au80Sn20 eutectic solder and Ni/Au coating in soldering

作　　者：胡子翔 张阳阳 王梅[1,2] 王昭漫 杨欢天 HU Zixiang;ZHANG Yangyang;WANG Mei;WANG Zhaoman;YANG Huantian(No.38 Research Institute of CETC,Hefei 230088,China;National Industrial Design Center(CETC 38),Hefei 230088,China;State Key Laboratory of Material Processing and Die&Mould Technology,Huazhong University of Science&Technology,Wuhan 430074,China)

机构地区：[1]中国电子科技集团公司第三十八研究所,安徽合肥230088 [2]国家级工业设计中心(中电38所),安徽合肥230088 [3]华中科技大学材料成形与模具技术国家重点实验室,湖北武汉430074

出　　处：《电焊机》2020年第2期19-24,I0003,I0004,共8页Electric Welding Machine

基　　金：国防基础科研项目（JCKY2016210B002)

摘　　要：采用Au80Sn20共晶钎料钎焊4J34可伐合金基板与铝硅基板(50%Si-Al),板材表面均有Ni/Au镀层。通过光学显微镜研究了工艺参数对钎缝宏观形貌的影响。采用扫描电镜、EDS能谱分析和XRD检测研究了钎缝组织成分以及钎料与基板、基板镀层间的元素扩散和界面反应,从而探究异种金属材料钎焊连接机理。结果表明,钎焊时,基板材料表面的Au层完全进入钎料中,暴露出的Ni层与钎料中的Sn形成金属间化合物Ni3Sn4,钎料发生共晶反应生成AuSn共晶与Au5Sn棒状枝晶,并析出大量的Au,Au5Sn包围在Ni3Sn4外围,钎料中间层形成AuSn共晶与富Au区。基板元素Fe、Co、Al、Si和钎料元素Au、Sn均无法通过Ni镀层的阻挡相互扩散,唯一能突破Ni镀层在基板和钎料中扩散的是P元素。4J34 kovar alloy substrate and aluminum silicon substrate(50%Si-Al)were soldered with Au80Sn20 eutectic solder,and the surfaces of the plates were coated with Ni/Au.The influence of procedure parameters on the macro morphology of soldering seam was studied by optical microscope.By means of SEM,EDS and XRD.the structure and composition of the brazing seam.the element diffusion and interface reaction between the solder and substrate and the substrate coating were studied,and the soldering joining mechanism of dissimilar metal materials was studied.The results show that the Au layer on the surface of the substrate completely enters the solder,and the exposed Ni layer and the Sn in solder form intermetallic compound Ni3Sn4.AuSn eutectic and Au3Sn rod dendrite are formed by eutectic reaction of solder,and a large amount of Au is precipitated.AujSn is surrounded by Ni3Sn4,and AuSn eutectic and Au-rich area are formed in the middle layer of solder.The substrate element Fe.Co.Al.Si and the filler metal element Au and Sn can not diffuse through the barrier of Ni coating.The element P is the only element that can break through the Ni coating and diffuse in the substrate and solder.

关 键 词：共晶钎料 4J34可伐合金 界面反应 异种金属 连接机理 

分 类 号：TG425[金属学及工艺—焊接]