基于某款手机后盖模具设计及工艺优化研究  

Based on a Mobile Phone Back Cover Mold Design and Process Optimization Research

作　　者：邹金红[1] 杨敏敏 罗华云[3] ZOU Jin-hong;YANG Min-min;LUO Hua-yun(Nanchang Institute of Technology,Nanchang 330108,China;Jiangxi Science and Technology Vocational College,Nanchang 330200,China;Science and Technology College of Nanchang University,Nanchang 330029,China)

机构地区：[1]南昌工学院,江西南昌330108 [2]江西科技职业学院,江西南昌330200 [3]南昌大学科学技术学院,江西南昌330029

出　　处：《塑料工业》2020年第1期73-77,共5页China Plastics Industry

基　　金：江西省教育厅科学技术研究项目(GJJ181065)

摘　　要：针对某款手机后盖结构特点,利用Moldflow软件进行了型腔布局和浇口位置优化设计,结合优化设计进行凸模和凹模的结构设计、侧向抽芯机构设计,最后设计了模具三维总装配图;然后选择六因素五水平的正交试验方案,以体积收缩率、缩痕指数和翘曲变形量为评价产品质量的指标,利用极差分析成型因素对评价指标的显著性影响,并结合综合平衡法得到了最佳工艺参数组合,并验证了该优化组合的合理性。According to the structural characteristics of the back cover of a mobile phone,the layout of the cavity and the position of the gate were optimized by Moldflow software.Combined with the optimization design,the structure of the punch and die,the lateral core-pulling mechanism were designed.Finally,the three dimensional(3 D) general assembly drawing of the mold was designed.Then six factors and five levels of orthogonal experiment were selected,with volumetric shrinkage,shrinkage index and warping deformation as the evaluation index of the quality of the products.The range analysis was used to analyze the effect of forming factors on the significance of evaluation index.And combining with comprehensive balance method,the optimal process parameters combination was obtained,the rationality of the optimum combination was verified.

关 键 词：手机后盖 模具设计 正交试验 极差分析 综合平衡法 

分 类 号：TQ320.662[化学工程—合成树脂塑料工业]