氧化物功能薄膜器件的柔性化策略  

Flexibilization Strategies of Functional Oxide Thin Film Devices: a Review

作　　者：王倩 高能 张天垚 姚光[1] 潘泰松[1] 高敏[1] 林媛[1] WANG Qian;GAO Neng;ZHANG Tianyao;YAO Guang;PAN Taisong;GAO Min;LIN Yuan(State Key Laboratory of Electronic Thin Films and Integrated Devices,University of Electronic Science and Technology of China,Chengdu 610054,China)

机构地区：[1]电子科技大学电子薄膜与集成器件国家重点实验室

出　　处：《材料导报》2020年第1期14-21,共8页Materials Reports

基　　金：国家重点基础研究发展计划(2015CB351905);国家自然科学基金(61825102; 51872038; 61901085)~~

摘　　要：以可延展和可弯曲为特点的柔性电子器件因其在信息、医疗、能源等领域的巨大前景而受到众多研究者的广泛关注,成为近年来的研究热点。氧化物功能薄膜材料由于其丰富的电学/磁学/光学等性能及独特的多场耦合特性,成为物理学和材料学的重要研究对象,并被应用于各种电学/光学器件中。随着器件越来越多地应用于各种复杂曲面环境以及与人体或人体组织密切贴合,对氧化物薄膜器件可延展和可弯曲等柔性化的需求日益迫切。由于高质量氧化物薄膜的生长需要较高的温度,且对生长基底和薄膜之间的界面控制要求较高,因此,氧化物薄膜与可延展柔性基底的集成存在很大的挑战。将氧化物薄膜直接沉积在柔性金属箔片或高分子基底上,需要克服金属基底与薄膜界面控制困难或高分子基底对生长温度的耐受性差等困难。在刚性基底上沉积功能氧化物薄膜后,通过剥离、转印到可延展柔性基底上是一种解决方案。但其中的挑战在于如何可控地将薄膜完整地从生长基底剥离。针对这一挑战,发展了通过化学刻蚀牺牲层的化学转印技术和通过范德瓦尔斯外延或激光剥离的物理剥离方法。本文综述了近年来发展的氧化物薄膜器件柔性化的若干进展,归纳了以上几种主要的柔性化策略,包括在金属基底、高分子基底等柔性基底上直接生长和通过化学刻蚀和物理剥离转印等技术实现的柔性化,分析了几种柔性化策略的优势和局限性,总结了柔性氧化物薄膜器件制备中的挑战和机遇。Flexible electronic devices,which are characterized by stretchability and bendability,have attracted tremendous interests because of their great application potential in the fields of information,medicine,energy and so on. Functional oxide thin-film materials have become an important research object in physics and materials science due to their rich electrical,magnetic,optical and unique multi-field coupling properties,and wide usage in the electronic and optoelectronic devices. With more and more devices being introduced to various complex curved surfaces and contact with human or human tissue,the demand for flexible oxide film devices such as stretchability and bendability is becoming more and more urgent.Due to the high temperature required for the growth of high-quality oxide films and the critical requirements for the interface control between the substrate and the film,the integration of oxide films with the stretchable and flexible substrates faces huge challenges. To deposit the oxide film directly on a flexible metal foil or a polymer substrate,it is necessary to overcome the difficulties of controlling the interface between the metal substrate and the film or the poor tolerance of the polymer substrate to the growth temperature. After depositing functional oxide films on rigid substrates,peeling and transferring thin films to a stretchable and flexible substrate is another solution. But the challenge is how to peel the film controllably and completely from the growth substrate. In response to this challenge,the chemical transfer printing technology by etching sacrificial layer and the physical stripping method by van der Waals epitaxy or laser stripping were developed.In this paper,the development of flexibility oxide thin film devices in recent years is reviewed. Main flexibility strategies are summarized,including direct growth on flexible substrates such as metal substrates and polymer substrates,and transfer-printing after chemical etching or physical stripping.The advantages and limits of these str

关 键 词：金属氧化物 功能薄膜 柔性化策略 直接生长法 化学转印法 物理剥离法 

分 类 号：O484.1[理学—固体物理]