Flatness maintenance and roughness reduction of silicon mirror in chemical mechanical polishing process  

作　　者：JIANG BoCheng ZHAO DeWen WANG BingQuan ZHAO HuiJia LIU YuHong LU XinChun 

机构地区：[1]Department of Mechanical Engineering,Tsinghua University,Beijing 100084,China [2]Hwatsing Technology Co.,Ltd,Tianjin 300350,China

出　　处：《Science China(Technological Sciences)》2020年第1期166-172,共7页中国科学（技术科学英文版）

基　　金：supported by the National Basic Research Program of China(Grant No.2015CB057203);the National Natural Science Foundation of China(Grant No.91323302)

摘　　要：As an important optical component in laser system,silicon mirror surface is required to have micron-level flatness and subnanometer-level roughness.The research concentrates on how to improve roughness as far as possible while maintaining flatness of silicon mirror surface during chemical mechanical polishing(CMP)process.A polishing edge effect model is established to explain the reason of flatness deterioration,and a roughness theoretical model is set up to get the limit of perfect surface roughness.Based on the models above,a polishing device is designed to maintain the surface flatness,and the optimized polishing process parameters are obtained by orthogonal tests to get a near-perfect surface roughness.Finally the maintenance of flatness and the improvement of roughness can be achieved at the same time in one step of CMP process.This work can be a guide for silicon mirror manufacture to improve optical reflection performance significantly.As an important optical component in laser system, silicon mirror surface is required to have micron-level flatness and subnanometer-level roughness. The research concentrates on how to improve roughness as far as possible while maintaining flatness of silicon mirror surface during chemical mechanical polishing(CMP) process. A polishing edge effect model is established to explain the reason of flatness deterioration, and a roughness theoretical model is set up to get the limit of perfect surface roughness. Based on the models above, a polishing device is designed to maintain the surface flatness, and the optimized polishing process parameters are obtained by orthogonal tests to get a near-perfect surface roughness. Finally the maintenance of flatness and the improvement of roughness can be achieved at the same time in one step of CMP process. This work can be a guide for silicon mirror manufacture to improve optical reflection performance significantly.

关 键 词：chemical mechanical polishing silicon mirror flatness maintenance roughness reduction 

分 类 号：TH74[机械工程—光学工程]