基于Icepak的功率混合集成电路热设计分析  

Thermal Analysis of Power HIC Based on Icepak

作　　者：冯雯雯 吕果 杨松 韩闯 马朝骥 FENG Wenwen;LV Guo;YANG Song;HAN Chuang;MA Chaoji

机构地区：[1]中国电子科技集团公司电子第24研究所,重庆400060

出　　处：《科技视界》2020年第2期40-42,共3页Science & Technology Vision

摘　　要：本文基于ANSYS Icepak软件,对影响功率集成电路热性能的功能模块布局方式以及外壳、基板、布线、焊接材料等设计因素进行初步研究,为功率集成电路的热设计分析提供了建议和依据。Based on the simulation software ANSYS Icepak,the main influencing factors of thermal performance of Power Hybrid Integrated Circuit were studied, which involve the layout processing and the material of metal, substrates, conductors and solder alloy. According to the analysis of the results of the design,a reasonable proposal of Power HIC was put forward.

关 键 词：ANSYS Icepak 热设计 功率集成电路 

分 类 号：TM464[电气工程—电器]