ZHL-02碱性无氰电镀银工艺的抗金属杂质污染性能  

Resistance to disturbance of metallic impurities during silver electroplating in ZHL-02 alkaline cyanide-free bath

作　　者：孙志 程娜 陈峰 赵健伟[1] SUN Zhi;CHENG Na;CHEN Feng;ZHAO Jianwei(China-Australia Institute for Advanced Materials and Manufacturing,College of Materials and Textile Engineering,Jiaxing University,Jiaxing 314001,China)

机构地区：[1]嘉兴学院材料与纺织工程学院中澳先进材料与制造研究院

出　　处：《电镀与涂饰》2020年第5期249-254,共6页Electroplating & Finishing

基　　金：嘉兴市科技计划营业性基础研究专项(2019AD32017)

摘　　要：研究了Cu^2+、Fe^2+、Zn^2+和Ni^2+四种杂质离子对ZHL-02无氰镀银液颜色,以及镀层外观和微观结构的影响。结果表明,Cu^2+的质量浓度小于0.5g/L时对镀层成分和结晶组织没有影响。质量浓度均为0.1g/L的Cu^2+、Fe^2+和Zn^2+三种杂质离子共存于镀液中时,镀层性能受影响不大。镀液中存在Ni^2+离子会使镀银层灰暗、粗糙。The effects of four kinds of impurity ions i.e.Cu^2+,Fe^2+,Zn^2+,and Ni^2+on the color of ZHL-02 alkaline cyanide-free silver electroplating bath,as well as the appearance and microstructure of the coating obtained therefrom were studied.The results showed that Cu2+had no effect on the composition and crystal structure of silver coating when its mass concentration was 0.5 g/L below.The coexistence of 0.1 g/L of Cu^2+,Fe^2+,and Zn^2+ in bath had slight effect on the properties of silver coating.The silver coating electroplated from the bath containing Ni2+was murky grey and rough.

关 键 词：无氰电镀银 金属杂质 成分 微观结构 

分 类 号：TQ153.16[化学工程—电化学工业]