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作 者:理莎莎 刘乃亮[2] 方长青 LI Sha-sha;LIU Nai-liang;FANG Chang-qing(Faculty of Printing,Packaging Engineering and Digital Media Technology,Xi'an University of Technology,Xi'an 710048,China;School of Sciences,Xi'an University of Technology,Xi'an 710054,China)
机构地区:[1]西安理工大学印刷包装与数字媒体学院,西安710048 [2]西安理工大学理学院,西安710054
出 处:《包装工程》2020年第5期137-142,共6页Packaging Engineering
基 金:陕西省教育厅自然科学专项(18JK0584);陕西省重点研发计划-国际科技合作项目(2018KW-054)。
摘 要:目的对比探讨氮化物陶瓷颗粒AlN和BN对热塑性酚醛树脂复合材料导热率的影响,制备高导热复合材料,并将其应用于电子塑封领域。方法首先,采用硅烷偶联剂对AlN和BN进行表面改性,以增强其在有机聚合物中的分散性。然后通过在线性酚醛树脂中添加不同粒径的陶瓷颗粒,对比粒径及填料含量对线性酚醛树脂复合材料导热率的影响,从声子角度分析,获取适合作为提高复合材料导热性能的填料。结果经过硅烷偶联剂表面改性后,陶瓷颗粒AlN、BN与水的接触角变大,与树脂的接触角变小,能够更好地分散在线性酚醛树脂中。在线性酚醛树脂中添加不同粒径、不同含量的AlN和BN,发现在不同含量范围内,填料粒径对复合材料导热率的影响不同。根据声子传递热量理论分析,BN较AlN在与C形成的界面上更容易传输热量,从而实现了较高的导热率。结论氮化物陶瓷颗粒能够很好地增强复合材料的导热率,尤其是BN,其态密度和C的态密度重叠率极高,更适合在BN与C的界面快速传递热量。The paper aims to discuss and compare the effects of nitride ceramic particles AlN and BN on the thermal conductivity of thermoplastic phenolic resin composites, prepare high-thermal composite materials and apply them to electronic plastic packaging. Firstly, AlN and BN were surface-modified with a silane coupling agent to enhance the dispersibility in the organic polymer. Then, by adding the ceramic particles different size to the linear phenolic resin, the effects of particle of sizes, the effects of particle size and filler content on the thermal conductivity of the linear phenolic resin composite were compared to obtain filler for improving the thermal conductivity of the composite from the phonon point of view. The experimental results showed that after surface modification, the contact angles of the ceramic particles AlN and BN with water became large;while those angles with resin became small. So the silane coupling agent made the filler dispersed better in the novolac resin than in water. AlN and BN with different particle sizes were filled with linear phenolic resin at different contents. The effect of filler particle size on the thermal conductivity of the composite was different with different contents. According to the heat transfer analysis of phonon, BN transferred heat easier than AlN at the interface formed with C, achieving high thermal conductivity. Nitride ceramic particles can well enhance the thermal conductivity of the composite, especially BN. The overlap of density of states(DOS) of BN and C are extremely high, which is more suitable for rapid heat transferring at BN and C interfaces.
分 类 号:TB333[一般工业技术—材料科学与工程]
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