HPS整流管芯片散热效率计算仿真研究  

Simulation Study on Heat Dissipation Efficiency Calculation of High Power Semiconductor Rectifier Chip

作　　者：皮小林[1] 李瑞林[1] 王乐平[1] PI Xiao-lin;LI Rui-lin;WANG Le-ping(Gongqing College,Nanchang University,Jiujiang Jiangxi 332000,China)

机构地区：[1]南昌大学共青学院,江西九江332000

出　　处：《计算机仿真》2020年第1期66-69,共4页Computer Simulation

摘　　要：针对传统散热效率计算方法存在计算时间过长、计算效率过低以及计算误差偏高等问题,提出了一种新的散热效率计算方法———基于傅里叶导热方程的散热效率计算方法。通过对高功率半导体整流管芯片进行分析,引用傅里叶导热方程计算出整流管芯片的传热热阻,根据传热热阻随着温度的变化,获取高功率半导体整流管芯片散热系数。根据高功率半导体整流管芯片散热系数,构建高功率半导体整流管芯片散热模型,利用建立的模型分析转速、冷气流入口的压力和速度以及冷却孔的分布等对转子温度场的以及散热效率的影响,优化散热路径,完成高功率半导体整流管芯片散热计算。实验结果表明,所提方法有效减少了计算时间,提高了计算效率,与此同时,降低了计算误差,使计算结果更为准确。Due to long calculation time,low calculation efficiency and high calculation error of traditional method,this paper proposed a method to calculate heat dissipation efficiency based on Fourier heat conduction equation.By analyzing the high-power semiconductor rectifying tube chip,we used Fourier heat conduction equation to calculate heat-transfer resistance of rectifying tube chip.Because the heat transfer resistance changed with temperature,we could get the heat dissipation coefficient of high-power semiconductor rectifying tube chip.According to this coeffi-cient,we built the heat dissipation model of high-power semiconductor rectifying tube chip and then used this model to analyze the influence of the rotational speed,the pressure and velocity of cool airflow inlet and the distribution of cooling holes on the rotor temperature field and the heat dissipation efficiency.Finally,we optimized the heat dissipa-tion path and thus to complete the heat dissipation calculation of high-power semiconductor rectifying tube chip.Sim-ulation results prove that the proposed method effectively reduces the calculation time and improves the calculation ef-ficiency.Meanwhile,the calculation error is reduced and the calculation result is more accurate.

关 键 词：高功率半导体 整流管芯片 散热效率计算 

分 类 号：TP393[自动化与计算机技术—计算机应用技术]