铜质电子产品表面化学镀锡研究  

Study on Electroless Tin Plating on Copper Electronic Products

作　　者：李祥[1] 李培英 LI Xiang;LI Peiying(Henan Institute of Economics and Trade,Zhengzhou 450000,China;Henan University of Economics and Law,Zhengzhou 450000,China)

机构地区：[1]河南经贸职业学院,河南郑州450000 [2]河南财经政法大学,河南郑州450000

出　　处：《电镀与精饰》2020年第3期39-42,共4页Plating & Finishing

基　　金：河南省科技厅项目(9412015Y1363)。

摘　　要：以电子产品常用的T2紫铜作为基体进行化学镀锡。通过改变沉积时间,制备了厚度为0.5~4.2μm的锡镀层。采用扫描电镜分析了锡镀层的微观形貌,采用电化学工作站测试了锡镀层的和紫铜的交流阻抗谱,对耐腐蚀性能进行比较。结果表明:紫铜表面化学镀锡后,其耐腐蚀性能得到改善。沉积时间对锡镀层的微观形貌和耐腐蚀性能有一定影响;随着沉积时间从3 min延长至70 min,锡镀层的微观形貌发生变化,耐腐蚀性能经历了先变好后变差的过程;沉积时间为55 min时制备的锡镀层中主要含有Sn、Cu和C元素,含量分别为89.48%、3.72%、6.80%,各元素均匀分布,其耐腐蚀性能最好。Electroless tin plating experiment was carried out on T2 red copper which was commonly used in electronic products.Tin coatings with a thickness of 0.5-4.2μm were prepared by changing deposition time.Scanning electron microscope was used to analyze the microstructure of tin coating and electrochemical workstation was used to test the corrosion resistance of tin coating.The corrosion resistance of tin coating was compared with that of red copper.The results showed that the corrosion resistance of red copper was improved after electroless tin plating,while deposition time has an effect on the microstructure and corrosion resistance of tin coating.With the prolonging of deposition time from 3 min to 70 min,the microstructure of tin coating was changed,and the corrosion resistance of tin coating experienced a process of getting better to getting worse.When the deposition time was 55 min,the tin coating was mainly composed of Sn,Cu and C and possessed the best corrosion resistance.The content of Sn,Cu and C was 89.48%、3.72%、6.80%,respectively.These elements were evenly distributed in the coating.

关 键 词：化学镀锡 沉积时间 锡镀层厚度 微观形貌 耐腐蚀性能 

分 类 号：TQ153[化学工程—电化学工业]