Ni添加量对铜基板和石墨烯铜基板的界面反应和IMC生长的影响  

Effect of Ni Addition in Sn0.7Ag0.5Cu on Interfacial Reaction and IMC Growth of Cu and Graphene-coated Cu Substrates

作　　者：蔡洪明 刘洋[2,3] 张浩[2,3] 李胜利 孙凤莲[3] 张国旗[2] Cai Hongming;Liu Yang;Zhang Hao;Li Shengli;Sun Fenglian;Zhang Guoqi(Harbin University of Science and Technology,Harbin 150040,China;Delft University of Technology,Delft 2600 AA,Netherlands)

机构地区：[1]哈尔滨理工大学材料科学与工程学院,黑龙江哈尔滨150040 [2]代尔夫特理工大学,荷兰代尔夫特2600AA [3]哈尔滨理工大学,黑龙江哈尔滨150040

出　　处：《稀有金属材料与工程》2020年第1期27-33,共7页Rare Metal Materials and Engineering

基　　金：National Natural Science Foundation of China(51604090);Natural Science Foundation of Heilongjiang Province(E2017050);University Nursing Program for Young Scholars with Creative Talents in Heilongjiang Province(UNPYSCT-2015042)。

摘　　要：研究了钎焊与时效过程中,在Sn0.7Ag0.5Cu(SAC0705)钎料与Cu基板和石墨烯Cu基板界面处金属间化合物(IMC)的形成与演变。采用加热平台制备焊接试样并在120℃时效600h。结果表明,界面金属间化合物在时效过程中增厚。SAC0705/Cu和SAC0705/G-Cu 2种焊接界面金属间化合物均为Cu6Sn5。当钎料中添加Ni元素后,Cu6Sn5化合物转变为(Cu,Ni)6Sn5。随着钎料中Ni元素含量的增大,2种基板上的界面金属间化合物厚度先增加后减小。此外,随着Ni含量增大,化合物生长速率降低。石墨烯Cu基板表面的石墨烯层起到扩散阻挡层效果,因此,石墨烯Cu板上的化合物厚度小于常规Cu基板,同时其界面化合物生长速率较低。The formation and growth of intermetallic compound(IMC)layer at the interface between Sn0.7 Ag0.5 Cu(SAC0705)solder and Cu or graphene-coated Cu(G-Cu)substrates were investigated during soldering and aging.The samples were soldered on a heating platform by aging treatment at 120°C for up to 600 h.The results show that the thickness of IMC increases with increasing the aging time.The Cu6Sn5 IMC layer is observed at SAC0705/Cu and SAC0705/G-Cu interfaces.With the addition of Ni element in the solder,Cu6Sn5 transforms into(Cu,Ni)6 Sn5.With the increase of Ni content,the thickness of IMC shows an increase trend first and then decreases on the two kinds of substrates.Moreover,as the Ni content increases,the growth rate constant of interfacial IMC layer decreases.Since the graphene layer works as a diffusion barrier,the IMC on G-Cu is thinner than that on Cu substrate.And the growth rate constant of the interfacial IMC on G-Cu substrate is lower than that on Cu substrate.

关 键 词：石墨烯铜基板 焊点 金属间化合物 镍元素 

分 类 号：TG454[金属学及工艺—焊接] TG156.92