Effect of Ga on microstructure and properties of Sn-Zn-Bi solder for photovoltaic ribbon  

作　　者：Zhang Min Xu Huanrui Wang Gang Zhu Ziyue 张敏;许桓瑞;王刚;朱子越(School of Materials,Xi′an University of Technology,Xi′an 710048,China)

机构地区：[1]School of Materials,Xi′an University of Technology,Xi′an 710048,China

出　　处：《China Welding》2019年第4期1-7,共7页中国焊接（英文版）

基　　金：Natural Science Foundation of Shaanxi Provincial Department(No.51974243);Science and Technology Program of Xi'an(Grant No.201805037YD15CG21(16));Natural Science Foundation of Shaanxi Provincial Department(No.2019JZ-31);Natural Science Foundation of Shaanxi Provincial Department(No.2019JQ-284).

摘　　要：In this study,SEM,EDS,XRD and other test methods were used to study the effects of different Ga contents(0~2 wt.%)on microstructure,electrical conductivity,spreading area and mechanical properties of Sn-9Zn-3Bi solder.The results revealed that the microstructure of Sn-Zn-Bi-Ga solder alloy was mainly composed ofβ-Sn,Zn-rich,Bi-rich phase and Sn-Zn eutectic structure.The Ga can significantly improve the wettability of Sn-Zn-Bi on the pure copper,the maximum wetting area was 105.3 mm^2.With the increase of the Ga content the melting point of the solders decreased from 195℃to 177℃.In addition,the Ga element can increase the oxidation resistance of solder.Its conductivity showed a decreasing trend with the gradual increase of the Ga content.With the increased of the Ga content the IMC(Intermetallic Compound)of Sn-Zn-Bi-xGa/Cu is only Cu5Zn8 and its thickness decreased remarkably.

关 键 词：Sn-Zn-Bi-Ga solder microstructure wetting area intermetallic compound 

分 类 号：TM914.4[电气工程—电力电子与电力传动] TG42[金属学及工艺—焊接]