激光诱导空化微孔冲裁试验研究  

Experimental study on laser induced cavitation micro-hole blanking

作　　者：黄兴 郭钟宁[1] 陈铁牛[1] 王亮亮 谢明 Huang Xing;Guo Zhongning;Chen Tieniu;Wang Liangliang;Xie Ming(School of Electromechanical Engineering,Guangdong University of Technology,Guangzhou 510006,China)

机构地区：[1]广东工业大学机电工程学院,广州510006

出　　处：《现代制造工程》2020年第4期13-17,共5页Modern Manufacturing Engineering

基　　金：国家自然科学基金资助项目(51175091);佛山市科技创新团队项目(20151T100162)。

摘　　要：针对微尺度下金属箔模具冲孔存在模具挤压磨损、对中困难,激光打孔存在烧蚀、吸收层无法补偿等问题,提出通过激光诱导空泡对金属箔进行加载来实现冲裁小孔的方法。研究了不同激光焦点位置(H=0~4 mm)、激光能量(E=10.3~50.8 mJ)和铜箔厚度(T=20~70μm)对铜箔冲孔的影响,发现激光焦点位置影响明显,当铜箔变形平均深度达到147.0μm后,铜箔发生剪切断裂,可实现冲裁,并且制备的小孔边缘正表面无烧蚀、毛边、裂纹和卷边等缺陷。同时,利用高速摄影仪对激光诱导空化微孔冲裁过程进行研究,结果表明激光诱导空化微孔冲裁过程是激光等离子体冲击波、空泡溃灭冲击波和微射流共同加载的过程。For the micro-scale metal foil,there are problems such as extrusion wear,difficulty in mold alignment in the die punching process,and ablation and no replenishment for the absorbing layer in the laser drilling process.The method of loading the metal foil by the laser-induced bubble to punch small hole was introduced.The influence of laser focus position(H=0~4 mm),laser energy(E=10.3~50.8 mJ),and copper foil thickness(T=20~70μm)on the copper foil punching were studied.It was found that the influence of laser focus position was obvious,the copper foil was sheared and fractured when the deformation depth of copper foil reached 147.0μm,small holes processed by this method had no defects such as ablation,burrs,cracks and curling on the front surface of the edge.At the same time,the mechanism of the laser induced cavitation micro-hole blanking process was studied by high-speed camera.It is pointed out that the laser induced cavitation micro-hole blanking process is a process of laser plasma shock wave,cavitation collapse shock wave and micro jet working together.

关 键 词：激光诱导空化 微孔 金属箔板 冲裁 

分 类 号：TN249[电子电信—物理电子学]